Novel hybrid mask mold for combined nanoimprint and photolithography technique

Kanghun Moon; Banglim Choi; In Sung Park; Sunghun Hong; Kihyun Yang; Heon Lee; Jinho Ahn

doi:10.1016/j.mee.2006.01.055

Novel hybrid mask mold for combined nanoimprint and photolithography technique

Kanghun Moon
, Banglim Choi
, In Sung Park
, Sunghun Hong
, Kihyun Yang
, Heon Lee
, Jinho Ahn^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

We present a combined nanoimprint and photolithography (CNP) process for nano-size patterning to greatly simplify conventional ultraviolet nanoimprint lithography. The mold is a key component for precise patterning with CNP, and a novel hybrid mask mold with SiO₂ interlayer and hydrophobic agent treatment is suggested for easy detachment after imprinting. This allows a very simple process to get a complete pattern transfer without any defects.

Original language	English
Pages (from-to)	889-892
Number of pages	4
Journal	Microelectronic Engineering
Volume	83
Issue number	4-9 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.mee.2006.01.055
Publication status	Published - 2006 Apr

Bibliographical note

Funding Information:
This work was supported by the research fund of Hanyang University (HY-2004-S) and the KOSEF through Quantum Photonic Science Research Center.

Keywords

Anti-sticking property
Hybrid mask mold
Nanoimprint lithography
Photolithography

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Access to Document

10.1016/j.mee.2006.01.055

Cite this

@article{795d0dbbbc404818aa68016c94ed87be,

title = "Novel hybrid mask mold for combined nanoimprint and photolithography technique",

abstract = "We present a combined nanoimprint and photolithography (CNP) process for nano-size patterning to greatly simplify conventional ultraviolet nanoimprint lithography. The mold is a key component for precise patterning with CNP, and a novel hybrid mask mold with SiO2 interlayer and hydrophobic agent treatment is suggested for easy detachment after imprinting. This allows a very simple process to get a complete pattern transfer without any defects.",

keywords = "Anti-sticking property, Hybrid mask mold, Nanoimprint lithography, Photolithography",

author = "Kanghun Moon and Banglim Choi and Park, \{In Sung\} and Sunghun Hong and Kihyun Yang and Heon Lee and Jinho Ahn",

note = "Funding Information: This work was supported by the research fund of Hanyang University (HY-2004-S) and the KOSEF through Quantum Photonic Science Research Center. ",

year = "2006",

month = apr,

doi = "10.1016/j.mee.2006.01.055",

language = "English",

volume = "83",

pages = "889--892",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "4-9 SPEC. ISS.",

}

TY - JOUR

T1 - Novel hybrid mask mold for combined nanoimprint and photolithography technique

AU - Moon, Kanghun

AU - Choi, Banglim

AU - Park, In Sung

AU - Hong, Sunghun

AU - Yang, Kihyun

AU - Lee, Heon

AU - Ahn, Jinho

N1 - Funding Information: This work was supported by the research fund of Hanyang University (HY-2004-S) and the KOSEF through Quantum Photonic Science Research Center.

PY - 2006/4

Y1 - 2006/4

N2 - We present a combined nanoimprint and photolithography (CNP) process for nano-size patterning to greatly simplify conventional ultraviolet nanoimprint lithography. The mold is a key component for precise patterning with CNP, and a novel hybrid mask mold with SiO2 interlayer and hydrophobic agent treatment is suggested for easy detachment after imprinting. This allows a very simple process to get a complete pattern transfer without any defects.

AB - We present a combined nanoimprint and photolithography (CNP) process for nano-size patterning to greatly simplify conventional ultraviolet nanoimprint lithography. The mold is a key component for precise patterning with CNP, and a novel hybrid mask mold with SiO2 interlayer and hydrophobic agent treatment is suggested for easy detachment after imprinting. This allows a very simple process to get a complete pattern transfer without any defects.

KW - Anti-sticking property

KW - Hybrid mask mold

KW - Nanoimprint lithography

KW - Photolithography

UR - https://www.scopus.com/pages/publications/33748256723

UR - https://www.scopus.com/pages/publications/33748256723#tab=citedBy

U2 - 10.1016/j.mee.2006.01.055

DO - 10.1016/j.mee.2006.01.055

M3 - Article

AN - SCOPUS:33748256723

SN - 0167-9317

VL - 83

SP - 889

EP - 892

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 4-9 SPEC. ISS.

ER -

Novel hybrid mask mold for combined nanoimprint and photolithography technique

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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