@inproceedings{69ad7df97a284da6ab2235d4b05439a8,
title = "Numerical simulation and thermal failure analysis of SOM package",
abstract = "This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO2 and TiO2 for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package's performance and reliability, In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.",
author = "Kim, {Jae Choon} and Chung, {Jin Taek} and Lee, {Won Suk} and Kim, {Gyoung Bum} and Lee, {Dong Jin} and Cho, {Ji Man} and Yu, {Ji Hyuk} and Ju, {Byeong Kwon} and Hang, {Sung Woo} and Park, {Heung Woo} and Yun, {Sang Kyeong}",
year = "2007",
doi = "10.1109/ESIME.2007.359958",
language = "English",
isbn = "1424411068",
series = "EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007",
publisher = "IEEE Computer Society",
booktitle = "EuroSime 2007",
note = "EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 ; Conference date: 16-04-2007 Through 18-04-2007",
}