On-Demand Mobile CPU Cooling with Thin-Film Thermoelectric Array

Hammam Kattan, Sung Woo Chung, Jorg Henkel, Hussam Amrouch

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


On-demand cooling is inevitable to maximize the processor's performance, while fulfilling thermal constraints-this holds more in advanced technologies, where localized hotspots change during runtime. In this work, we propose to adopt an array of thin-film thermoelectric (TE) devices, which is integrated within the chip packaging, for both cooling and energy-harvesting purposes. Each TE device within the array can be during the runtime enabled either for energy harvesting or on-demand cooling. Our approach is implemented and evaluated using a mature finite elements analysis tool in which a commercial multicore mobile chip is modeled after careful calibrations together with state-of-the-art TE devices. Results demonstrate that our approach reduces the peak temperature by up to 24 circ C∘C and the average temperature by 10 circ C∘C across various benchmarks with the cost of 67.5 mW. Additionally, the harvested energy from the array of TE devices compensates for 89% of the required cooling energy.

Original languageEnglish
Article number9361095
Pages (from-to)67-73
Number of pages7
JournalIEEE Micro
Issue number4
Publication statusPublished - 2021 Jul 1

Bibliographical note

Publisher Copyright:
© 1981-2012 IEEE.


  • Energy harvesting
  • Mobile devices
  • Thermal management
  • Thermoelectric

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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