Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing

Kwang S. Lee; Hyojin Ahn; In Sik Chin; Jay H. Lee; Dae R. Yang

doi:10.3182/20020721-6-es-1901.00624

Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing

Kwang S. Lee
, Hyojin Ahn
, In Sik Chin
, Jay H. Lee
, Dae R. Yang^*

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

An optimal iterative learning control (ILC) technique based on a quadratic optimal criterion has been implemented and evaluated in an experimental rapid thermal processing (RTP) system fabricating 8-inch silicon wafers. The control technique is based on a time-varying linear state space model which approximates a nonlinear system along a reference trajectory. This ILC control technique is capable of making improvements in the control performance from one run to next and eventually converges to a minimum achievable tracking error despite model error. Through a series of experiments with wafers on which thermocouples are glued, it was observed that the wafer temperatures are steered to the reference trajectory reducing the differences overcoming various disturbances.

Original language	English
Title of host publication	IFAC Proceedings Volumes (IFAC-PapersOnline)
Editors	Gabriel Ferrate, Eduardo F. Camacho, Luis Basanez, Juan. A. de la Puente
Publisher	IFAC Secretariat
Pages	333-338
Number of pages	6
Edition	1
ISBN (Print)	9783902661746
DOIs	https://doi.org/10.3182/20020721-6-es-1901.00624
Publication status	Published - 2002
Event	15th World Congress of the International Federation of Automatic Control, 2002 - Barcelona, Spain Duration: 2002 Jul 21 → 2002 Jul 26

Publication series

Name	IFAC Proceedings Volumes (IFAC-PapersOnline)
Number	1
Volume	15
ISSN (Print)	1474-6670

Other

Other	15th World Congress of the International Federation of Automatic Control, 2002
Country/Territory	Spain
City	Barcelona
Period	02/7/21 → 02/7/26

Bibliographical note

Funding Information:
This work was supported by the Korean Ministry of Education through the Brain Korea 21 Project. Authors greatly acknowledge the support from Sangrae Joo, Kornic System Co. for the provision of wafers. J. H. Lee acknowledges the financial support from the National Science Foundation (CTS 9979873).

Publisher Copyright:
Copyright © 2002 IFAC.

Keywords

Identification
Iterative learning control
LQG
Rapid thermal processing
Time-varying linear state space model

ASJC Scopus subject areas

Control and Systems Engineering

Access to Document

10.3182/20020721-6-es-1901.00624

Cite this

Lee, K. S., Ahn, H., Chin, I. S., Lee, J. H., & Yang, D. R. (2002). Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. In G. Ferrate, E. F. Camacho, L. Basanez, & J. A. de la Puente (Eds.), IFAC Proceedings Volumes (IFAC-PapersOnline) (1 ed., pp. 333-338). (IFAC Proceedings Volumes (IFAC-PapersOnline); Vol. 15, No. 1). IFAC Secretariat. https://doi.org/10.3182/20020721-6-es-1901.00624

Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. / Lee, Kwang S.; Ahn, Hyojin; Chin, In Sik et al.
IFAC Proceedings Volumes (IFAC-PapersOnline). ed. / Gabriel Ferrate; Eduardo F. Camacho; Luis Basanez; Juan. A. de la Puente. 1. ed. IFAC Secretariat, 2002. p. 333-338 (IFAC Proceedings Volumes (IFAC-PapersOnline); Vol. 15, No. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, KS, Ahn, H, Chin, IS, Lee, JH & Yang, DR 2002, Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. in G Ferrate, EF Camacho, L Basanez & JA de la Puente (eds), IFAC Proceedings Volumes (IFAC-PapersOnline). 1 edn, IFAC Proceedings Volumes (IFAC-PapersOnline), no. 1, vol. 15, IFAC Secretariat, pp. 333-338, 15th World Congress of the International Federation of Automatic Control, 2002, Barcelona, Spain, 02/7/21. https://doi.org/10.3182/20020721-6-es-1901.00624

Lee KS, Ahn H, Chin IS, Lee JH, Yang DR. Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. In Ferrate G, Camacho EF, Basanez L, de la Puente JA, editors, IFAC Proceedings Volumes (IFAC-PapersOnline). 1 ed. IFAC Secretariat. 2002. p. 333-338. (IFAC Proceedings Volumes (IFAC-PapersOnline); 1). doi: 10.3182/20020721-6-es-1901.00624

Lee, Kwang S. ; Ahn, Hyojin ; Chin, In Sik et al. / Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing. IFAC Proceedings Volumes (IFAC-PapersOnline). editor / Gabriel Ferrate ; Eduardo F. Camacho ; Luis Basanez ; Juan. A. de la Puente. 1. ed. IFAC Secretariat, 2002. pp. 333-338 (IFAC Proceedings Volumes (IFAC-PapersOnline); 1).

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AB - An optimal iterative learning control (ILC) technique based on a quadratic optimal criterion has been implemented and evaluated in an experimental rapid thermal processing (RTP) system fabricating 8-inch silicon wafers. The control technique is based on a time-varying linear state space model which approximates a nonlinear system along a reference trajectory. This ILC control technique is capable of making improvements in the control performance from one run to next and eventually converges to a minimum achievable tracking error despite model error. Through a series of experiments with wafers on which thermocouples are glued, it was observed that the wafer temperatures are steered to the reference trajectory reducing the differences overcoming various disturbances.

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Optimal iterative learning control of wafer temperature uniformity in rapid thermal processing

Abstract

Publication series

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Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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