Optimization of hybrid ink formulation and ipl sintering process for ink-jet 3d printing

Jae Young Lee; Cheong Soo Choi; Kwang Taek Hwang; Kyu Sung Han; Jin Ho Kim; Sahn Nahm; Bum Seok Kim

doi:10.3390/nano11051295

Optimization of hybrid ink formulation and ipl sintering process for ink-jet 3d printing

Jae Young Lee, Cheong Soo Choi, Kwang Taek Hwang, Kyu Sung Han, Jin Ho Kim, Sahn Nahm, Bum Seok Kim

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO₂ insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO₂ ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO₂ insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 10¹³ Ω·cm. On the photo-cured SiO₂ insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100^◦ C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO₂ insulation layer of 5B.

Original language	English
Article number	1295
Journal	Nanomaterials
Volume	11
Issue number	5
DOIs	https://doi.org/10.3390/nano11051295
Publication status	Published - 2021 May

Bibliographical note

Funding Information:
This work was funded by the Ministry of Industry, Trade and Energy, and the Ministry of the Internal Ventures of the Republic of Korea. It is a world-class 300 project technology development support project (S2641323). The results of the study was carried out using the facility at the Korea Incheon Branch, Korea Institute of Ceramic Engineering & Technology, Incheon.

Funding Information:
Funding: This work was funded by the Ministry of Industry, Trade and Energy, and the Ministry of the Internal Ventures of the Republic of Korea. It is a world-class 300 project technology development support project (S2641323). The results of the study was carried out using the facility at the Korea Incheon Branch, Korea Institute of Ceramic Engineering & Technology, Incheon.

Publisher Copyright:
© 2021 by the authors. Licensee MDPI, Basel, Switzerland.

Keywords

IPL sintering
IPL-sinterable nano Cu ink
Ink-jet 3D printing
Photo-curable nano SiO ink
Rheological properties

ASJC Scopus subject areas

Chemical Engineering(all)
Materials Science(all)

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10.3390/nano11051295

Cite this

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title = "Optimization of hybrid ink formulation and ipl sintering process for ink-jet 3d printing",

abstract = "Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO2 insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO2 ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO2 insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 1013 Ω·cm. On the photo-cured SiO2 insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100◦ C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO2 insulation layer of 5B.",

keywords = "IPL sintering, IPL-sinterable nano Cu ink, Ink-jet 3D printing, Photo-curable nano SiO ink, Rheological properties",

author = "Lee, {Jae Young} and Choi, {Cheong Soo} and Hwang, {Kwang Taek} and Han, {Kyu Sung} and Kim, {Jin Ho} and Sahn Nahm and Kim, {Bum Seok}",

note = "Funding Information: This work was funded by the Ministry of Industry, Trade and Energy, and the Ministry of the Internal Ventures of the Republic of Korea. It is a world-class 300 project technology development support project (S2641323). The results of the study was carried out using the facility at the Korea Incheon Branch, Korea Institute of Ceramic Engineering & Technology, Incheon. Funding Information: Funding: This work was funded by the Ministry of Industry, Trade and Energy, and the Ministry of the Internal Ventures of the Republic of Korea. It is a world-class 300 project technology development support project (S2641323). The results of the study was carried out using the facility at the Korea Incheon Branch, Korea Institute of Ceramic Engineering & Technology, Incheon. Publisher Copyright: {\textcopyright} 2021 by the authors. Licensee MDPI, Basel, Switzerland.",

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AU - Kim, Jin Ho

AU - Nahm, Sahn

AU - Kim, Bum Seok

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AB - Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO2 insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO2 ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO2 insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 1013 Ω·cm. On the photo-cured SiO2 insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100◦ C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO2 insulation layer of 5B.

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Optimization of hybrid ink formulation and ipl sintering process for ink-jet 3d printing

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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