A semi-interlocking heat sink that operates based on the effect of flow acceleration in a curved channel is proposed to mitigate local heat fluxes from power electronics. The proposed heat sink offers easy manufacturability owing to its simple structure. A computational fluid dynamics simulation is developed and validated experimentally. The simulation is conducted based on periodic boundary conditions. The design of experiment method and the Kriging meta-modeling are used to optimize the heat sink. Furthermore, a multi-objective genetic algorithm is used to minimize thermal resistance and pressure drop. Based on the optimization results, the thermal and hydraulic characteristics are analyzed according to geometric changes. The analysis shows that the proposed heat sink affords a 30.4%–34.7% lower thermal resistance than plate-finned heat sinks at the same pumping power.
|International Journal of Heat and Mass Transfer
|Published - 2022 Feb
Bibliographical noteFunding Information:
This study was supported by the Korea Institute of Energy Technology Evaluation and Planning (KETEP) and the Ministry of Trade, Industry & Energy (MOTIE) of the Republic of Korea (no. 20208901010010 ).
© 2021 Elsevier Ltd
- Computational fluid dynamics
- Electronics cooling
- Forced convection
- Liquid-cooled heat sink
- Thermal management
ASJC Scopus subject areas
- Condensed Matter Physics
- Mechanical Engineering
- Fluid Flow and Transfer Processes