Packaging of the RF-MEMS switch

Heung Woo Park, Yun Kwon Park, Duck Jung Lee, Byeong Kwon Ju

Research output: Contribution to journalConference articlepeer-review

2 Citations (Scopus)


In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Original languageEnglish
Pages (from-to)234-243
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 2001
Externally publishedYes
EventDesign, Chararacterization, and Packaging for MEMS and Microelectronics II - Adelaide, Australia
Duration: 2001 Dec 172001 Dec 19


  • B-stage epoxy
  • Bump
  • Flip-chip
  • Switch
  • Vertical feed-through
  • Wafer-level packaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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