Packaging of the RF-MEMS switch

Heung Woo Park; Yun Kwon Park; Duck Jung Lee; Byeong Kwon Ju

doi:10.1117/12.448864

Packaging of the RF-MEMS switch

Heung Woo Park, Yun Kwon Park, Duck Jung Lee, Byeong Kwon Ju

Research output: Contribution to journal › Conference article › peer-review

2 Citations (Scopus)

Abstract

In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Original language	English
Pages (from-to)	234-243
Number of pages	10
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4593
DOIs	https://doi.org/10.1117/12.448864
Publication status	Published - 2001
Externally published	Yes
Event	Design, Chararacterization, and Packaging for MEMS and Microelectronics II - Adelaide, Australia Duration: 2001 Dec 17 → 2001 Dec 19

Keywords

B-stage epoxy
Bump
Flip-chip
RF-MEMS
Switch
Vertical feed-through
Wafer-level packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.448864

Cite this

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abstract = "In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.",

keywords = "B-stage epoxy, Bump, Flip-chip, RF-MEMS, Switch, Vertical feed-through, Wafer-level packaging",

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AU - Lee, Duck Jung

AU - Ju, Byeong Kwon

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Y1 - 2001

N2 - In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

AB - In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within -0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

KW - B-stage epoxy

KW - Bump

KW - Flip-chip

KW - RF-MEMS

KW - Switch

KW - Vertical feed-through

KW - Wafer-level packaging

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ER -

Packaging of the RF-MEMS switch

Abstract

Keywords

ASJC Scopus subject areas

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