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PDP tubeless packaging using B-stage epoxy

  • Seung Il Moon*
  • , Duck Jung Lee
  • , Myung Hwan Oh
  • , Yun Hi Lee
  • , Byeong Kwon Ju
  • , Young Cho Kim
  • , Gwon Jin Moon
  • , Jun Dong Kim
  • *Corresponding author for this work

    Research output: Contribution to journalConference articlepeer-review

    Abstract

    In this paper, the AC-PDP was packaged with a newly developed tubeless packaging method using a B-stage epoxy. This method was performed at low temperature less than 200°C in He-Ne(27%)-Xe(3%) gas ambient. The PDP was successfully packaged and fully emitted. Also, the driving properties on operating time were investigated.

    Original languageEnglish
    Pages (from-to)961-964
    Number of pages4
    JournalSID Conference Record of the International Display Research Conference
    Publication statusPublished - 2001
    EventAsia Display/IDW 2001 - Nagoya, Japan
    Duration: 2002 Oct 162002 Oct 19

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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