Performance improvement of iterative closest point-based outdoor SLAM by rotation invariant descriptors of salient regions

Yong Ju Lee, Jae Bok Song, Ji Hoon Choi

    Research output: Contribution to journalArticlepeer-review

    12 Citations (Scopus)

    Abstract

    To navigate in an unknown environment, a robot should build a model for the environment. For outdoor environments, a three-dimensional (3-D) map is usually used as a main model. This study considers outdoor simultaneous localization and mapping (SLAM) to build a global 3-D map by matching local 3-D maps. An iterative closest point (ICP) algorithm is used to match local 3-D maps and estimate a robot pose, but an alignment error is generated by the ICP algorithm due to the false selection of corresponding points. We propose a new method to extract 3-D points that are valid for ICP matching. Rotation-invariant descriptors are introduced for robust correspondence. 3-D environmental data acquired by tilting a 2-D laser scanner are used to build local 3-D maps. Experimental results in real environments show the increased accuracy of the ICP-based matching and a reduction in matching time.

    Original languageEnglish
    Pages (from-to)349-360
    Number of pages12
    JournalJournal of Intelligent and Robotic Systems: Theory and Applications
    Volume71
    Issue number3-4
    DOIs
    Publication statusPublished - 2013 Sept

    Bibliographical note

    Funding Information:
    Acknowledgements This work was supported in part by the Agency for Defense Development and the Unmanned Technology Research Center, and in part by the Intelligent Robotics Development Program (Frontier R&D Program) funded by the Ministry of Knowledge Economy of the Korean government.

    Keywords

    • 3-D maps
    • Iterative closest point (ICP)
    • Mapping
    • Outdoor navigation
    • SLAM

    ASJC Scopus subject areas

    • Software
    • Control and Systems Engineering
    • Mechanical Engineering
    • Industrial and Manufacturing Engineering
    • Artificial Intelligence
    • Electrical and Electronic Engineering

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