Keyphrases
Compositionally Graded
20%
Crack Propagation
20%
Electron Beam Evaporation Method
20%
Electron Beam PVD
100%
Etching Depth
40%
Etching Resistance
20%
Field Emission Scanning Electron Microscopy (FE-SEM)
20%
Film Substrate
20%
Flakes
40%
Gas Mixture
20%
Inductively Coupled Plasma
20%
Nanofilm
100%
Plasma Condition
20%
Plasma Etching
20%
Plasma Resistance
100%
Quartz Plate
40%
Quartz Substrate
20%
Scanning Electron Microscopy Analysis
20%
Silica
100%
SiO2 Layer
20%
Structural Stability
20%
Thermal Mismatch
20%
Y2O3 Film
100%
Y2O3 Layer
20%
Yttrium Oxide
100%
Engineering
Crack Propagation
20%
Electron-Beam Evaporation
20%
Field-Emission Scanning Electron Microscopy
20%
Gas Mixture
20%
Inductively Coupled Plasma
20%
Interlayer
100%
Physical Vapor Deposition
100%
Silicon Dioxide
100%
Sio2 Layer
20%
Structural Stability
20%
Material Science
Crack Propagation
14%
Electron Microscopy
14%
Field Emission Scanning Electron Microscopy
14%
Film
100%
Gas Mixture
14%
Physical Vapor Deposition
100%
Plasma Etching
14%