Plasmonically-enhanced emission from an inverted GaN light emitting diode

Michael A. Mastro, Byung Jae Kim, J. A. Freitas, Joshua D. Caldwell, Ron Rendell, Jennifer Hite, Charles R. Eddy, Jihyun Kim

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Silver nanoparticles dispersed on the surface of an inverted GaN LED were found to plasmonically enhance the nearbandedge emission. The resonant surface plasmon coupling led to a significant enhancement in the exciton decay rate and the ensemble of nanoparticles provided a mechanism to scatter the coupled energy as free space radiation. The inverted LED structure employed a tunnel junction to avoid the standard thick p+ GaN current spreading contact layer. In contrast to a standard design, the top contact was a thin n++ AlGaN layer, which brought the quantum well into the fringing field of the silver nanoparticles. This proximity allowed the excitons induced within the quantum well to couple to the surface plasmons, which in turn led to the enhanced band edge emission from the LED.

    Original languageEnglish
    Title of host publicationPlasmonics
    Subtitle of host publicationMetallic Nanostructures and Their Optical Properties IX
    DOIs
    Publication statusPublished - 2011
    EventPlasmonics: Metallic Nanostructures and Their Optical Properties IX - San Diego, CA, United States
    Duration: 2011 Aug 212011 Aug 25

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume8096
    ISSN (Print)0277-786X

    Other

    OtherPlasmonics: Metallic Nanostructures and Their Optical Properties IX
    Country/TerritoryUnited States
    CitySan Diego, CA
    Period11/8/2111/8/25

    Keywords

    • GaN
    • LED
    • Plasmonic
    • Silver

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering

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