TY - JOUR
T1 - Polymer-metal composite thin film microcap packaging technology using low temperature SU-8 bonding
AU - Choi, Jinnil
AU - Kim, Yong Kook
AU - Kim, Soo Won
AU - Nam, Byung Hyun
AU - Ju, Byeong Kwon
N1 - Funding Information:
This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (NRF-2014R1A1A1008010).
Publisher Copyright:
Copyright © 2016 American Scientific Publishers All rights reserved.
PY - 2016
Y1 - 2016
N2 - This paper reports a packaging technology involving a lightweight, low temperature bonding process with a polymer-metal composite thin film microcap. A layer of SU-8, in the form of sealing rims, is used as an adhesive to bond the micro and nano-electromechanical systems (MEMS/NEMS) substrate with the microcap due to the excellent properties of SU-8 as a packaging material. A silicon oxide thin film layer is formed on the carrier wafer by using a furnace to separate the microcap from the carrier wafer once the bonding process between the host and the carrier wafer is complete. In addition, the thin-film polymer microcap retains its original shape and acts as a protective layer for the cavity after the carrier wafer is released. To characterize the bonding strength, tensile tests have been carried out, and the measurement results show that the bond strength is up to ∼15 MPa. This means that the proposed packaging method, with the thin-film polymer microcap on the host wafer, was successfully realized by the low temperature bonding and transfer process. Finally, to check and verify the mechanical conditions, such as stress and deflection, of the microcap in the atmosphere, finite element (FE) analysis has been performed.
AB - This paper reports a packaging technology involving a lightweight, low temperature bonding process with a polymer-metal composite thin film microcap. A layer of SU-8, in the form of sealing rims, is used as an adhesive to bond the micro and nano-electromechanical systems (MEMS/NEMS) substrate with the microcap due to the excellent properties of SU-8 as a packaging material. A silicon oxide thin film layer is formed on the carrier wafer by using a furnace to separate the microcap from the carrier wafer once the bonding process between the host and the carrier wafer is complete. In addition, the thin-film polymer microcap retains its original shape and acts as a protective layer for the cavity after the carrier wafer is released. To characterize the bonding strength, tensile tests have been carried out, and the measurement results show that the bond strength is up to ∼15 MPa. This means that the proposed packaging method, with the thin-film polymer microcap on the host wafer, was successfully realized by the low temperature bonding and transfer process. Finally, to check and verify the mechanical conditions, such as stress and deflection, of the microcap in the atmosphere, finite element (FE) analysis has been performed.
KW - Bonding
KW - Finite element analysis
KW - Micro/nano-electromechanical systems (MEMS/NEMS)
KW - Microcap packaging
UR - http://www.scopus.com/inward/record.url?scp=84992489187&partnerID=8YFLogxK
U2 - 10.1166/jnn.2016.13561
DO - 10.1166/jnn.2016.13561
M3 - Article
AN - SCOPUS:84992489187
SN - 1533-4880
VL - 16
SP - 11613
EP - 11618
JO - Journal of Nanoscience and Nanotechnology
JF - Journal of Nanoscience and Nanotechnology
IS - 11
ER -