Practical verification of power delivery networks for smart TV applications

Baekseok Ko; Joowon Kim; Jaemin Ryoo; Chulsoon Hwang; Seung Baek Park; Soo-Won Kim

doi:10.1109/ICCE.2015.7066541

Practical verification of power delivery networks for smart TV applications

Baekseok Ko, Joowon Kim, Jaemin Ryoo, Chulsoon Hwang, Seung Baek Park, Soo-Won Kim

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.

Original language	English
Title of host publication	2015 IEEE International Conference on Consumer Electronics, ICCE 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	594-595
Number of pages	2
ISBN (Print)	9781479975426
DOIs	https://doi.org/10.1109/ICCE.2015.7066541
Publication status	Published - 2015 Mar 23
Event	2015 IEEE International Conference on Consumer Electronics, ICCE 2015 - Las Vegas, United States Duration: 2015 Jan 9 → 2015 Jan 12

Other

Other	2015 IEEE International Conference on Consumer Electronics, ICCE 2015
Country/Territory	United States
City	Las Vegas
Period	15/1/9 → 15/1/12

Keywords

AP
decoupling capacitor
ODC
ODR
on co-simulation
power integrity
power modeling
power noise

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering

Access to Document

10.1109/ICCE.2015.7066541

Cite this

Ko, B, Kim, J, Ryoo, J, Hwang, C, Park, SB & Kim, S-W 2015, Practical verification of power delivery networks for smart TV applications. in 2015 IEEE International Conference on Consumer Electronics, ICCE 2015., 7066541, Institute of Electrical and Electronics Engineers Inc., pp. 594-595, 2015 IEEE International Conference on Consumer Electronics, ICCE 2015, Las Vegas, United States, 15/1/9. https://doi.org/10.1109/ICCE.2015.7066541

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title = "Practical verification of power delivery networks for smart TV applications",

abstract = "This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.",

keywords = "AP, decoupling capacitor, ODC, ODR, on co-simulation, power integrity, power modeling, power noise",

author = "Baekseok Ko and Joowon Kim and Jaemin Ryoo and Chulsoon Hwang and Park, {Seung Baek} and Soo-Won Kim",

year = "2015",

month = mar,

day = "23",

doi = "10.1109/ICCE.2015.7066541",

language = "English",

isbn = "9781479975426",

pages = "594--595",

booktitle = "2015 IEEE International Conference on Consumer Electronics, ICCE 2015",

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note = "2015 IEEE International Conference on Consumer Electronics, ICCE 2015 ; Conference date: 09-01-2015 Through 12-01-2015",

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T1 - Practical verification of power delivery networks for smart TV applications

AU - Ko, Baekseok

AU - Kim, Joowon

AU - Ryoo, Jaemin

AU - Hwang, Chulsoon

AU - Park, Seung Baek

AU - Kim, Soo-Won

PY - 2015/3/23

Y1 - 2015/3/23

N2 - This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.

AB - This paper introduces a practical methodology to improve power integrity performance of the chip-package-PCB systems for smart TVs. For power integrity analysis, a chip, package and PCB are modeled as lumped element circuits for simplicity. Case studies are presented to optimize MLCC placement using chip-package-PCB co-simulation under fixed SoC design. In case studies, CPU power net of an application processor is chosen, and voltage droop is measured as a design weight on each physical domains. The introduced methodology is evaluated through experimental verifications.

KW - AP

KW - decoupling capacitor

KW - ODC

KW - ODR

KW - on co-simulation

KW - power integrity

KW - power modeling

KW - power noise

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U2 - 10.1109/ICCE.2015.7066541

DO - 10.1109/ICCE.2015.7066541

M3 - Conference contribution

AN - SCOPUS:84936159740

SN - 9781479975426

SP - 594

EP - 595

BT - 2015 IEEE International Conference on Consumer Electronics, ICCE 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 IEEE International Conference on Consumer Electronics, ICCE 2015

Y2 - 9 January 2015 through 12 January 2015

ER -

Practical verification of power delivery networks for smart TV applications

Abstract

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Keywords

ASJC Scopus subject areas

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