Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

Nae Eung Lee; Hee Yeop Chae; Chee Won Chung; Hyun Woo Kim; Hyoung Sub Kim; Ji Hyun Kim; Jiyoung Kim; Taeyoon Lee; In Sung Park; Yi Kang Pu; Jianjun Shi; Ping Xu

doi:10.1016/j.tsf.2019.03.027

Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

Nae Eung Lee, Hee Yeop Chae, Chee Won Chung, Hyun Woo Kim, Hyoung Sub Kim, Ji Hyun Kim, Jiyoung Kim, Taeyoon Lee, In Sung Park, Yi Kang Pu, Jianjun Shi, Ping Xu

Department of Chemical and Biological Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Pages (from-to)	37-39
Number of pages	3
Journal	Thin Solid Films
Volume	680
DOIs	https://doi.org/10.1016/j.tsf.2019.03.027
Publication status	Published - 2019 Jun 30

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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10.1016/j.tsf.2019.03.027

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@article{8d1406463f704693ad59f069bd50364f,

title = "Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea",

author = "Lee, {Nae Eung} and Chae, {Hee Yeop} and Chung, {Chee Won} and Kim, {Hyun Woo} and Kim, {Hyoung Sub} and Kim, {Ji Hyun} and Jiyoung Kim and Taeyoon Lee and Park, {In Sung} and Pu, {Yi Kang} and Jianjun Shi and Ping Xu",

year = "2019",

month = jun,

day = "30",

doi = "10.1016/j.tsf.2019.03.027",

language = "English",

volume = "680",

pages = "37--39",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier",

}

TY - JOUR

T1 - Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

AU - Lee, Nae Eung

AU - Chae, Hee Yeop

AU - Chung, Chee Won

AU - Kim, Hyun Woo

AU - Kim, Hyoung Sub

AU - Kim, Ji Hyun

AU - Kim, Jiyoung

AU - Lee, Taeyoon

AU - Park, In Sung

AU - Pu, Yi Kang

AU - Shi, Jianjun

AU - Xu, Ping

PY - 2019/6/30

Y1 - 2019/6/30

UR - http://www.scopus.com/inward/record.url?scp=85064570969&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2019.03.027

DO - 10.1016/j.tsf.2019.03.027

M3 - Editorial

AN - SCOPUS:85064570969

SN - 0040-6090

VL - 680

SP - 37

EP - 39

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

ASJC Scopus subject areas

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