Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

Nae Eung Lee; Hee Yeop Chae; Chee Won Chung; Hyun Woo Kim; Hyoung Sub Kim; Ji Hyun Kim; Jiyoung Kim; Taeyoon Lee; In Sung Park; Yi Kang Pu; Jianjun Shi; Ping Xu

doi:10.1016/j.tsf.2019.03.027

Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

Nae Eung Lee^*
, Hee Yeop Chae
, Chee Won Chung
, Hyun Woo Kim
, Hyoung Sub Kim
, Ji Hyun Kim
, Jiyoung Kim
, Taeyoon Lee
, In Sung Park
, Yi Kang Pu
, Jianjun Shi
, Ping Xu

^*Corresponding author for this work

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Pages (from-to)	37-39
Number of pages	3
Journal	Thin Solid Films
Volume	680
DOIs	https://doi.org/10.1016/j.tsf.2019.03.027
Publication status	Published - 2019 Jun 30

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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10.1016/j.tsf.2019.03.027

Cite this

@article{8d1406463f704693ad59f069bd50364f,

title = "Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea",

author = "Lee, \{Nae Eung\} and Chae, \{Hee Yeop\} and Chung, \{Chee Won\} and Kim, \{Hyun Woo\} and Kim, \{Hyoung Sub\} and Kim, \{Ji Hyun\} and Jiyoung Kim and Taeyoon Lee and Park, \{In Sung\} and Pu, \{Yi Kang\} and Jianjun Shi and Ping Xu",

year = "2019",

month = jun,

day = "30",

doi = "10.1016/j.tsf.2019.03.027",

language = "English",

volume = "680",

pages = "37--39",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

AU - Lee, Nae Eung

AU - Chae, Hee Yeop

AU - Chung, Chee Won

AU - Kim, Hyun Woo

AU - Kim, Hyoung Sub

AU - Kim, Ji Hyun

AU - Kim, Jiyoung

AU - Lee, Taeyoon

AU - Park, In Sung

AU - Pu, Yi Kang

AU - Shi, Jianjun

AU - Xu, Ping

PY - 2019/6/30

Y1 - 2019/6/30

UR - https://www.scopus.com/pages/publications/85064570969

U2 - 10.1016/j.tsf.2019.03.027

DO - 10.1016/j.tsf.2019.03.027

M3 - Editorial

AN - SCOPUS:85064570969

SN - 0040-6090

VL - 680

SP - 37

EP - 39

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea

ASJC Scopus subject areas

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