Abstract
SrTiO3 thin films were prepared on Si(p-type 100) and Pt/SiO2/Si substrates using ECR plasma (or without ECR plasma) assisted MOCVD. Sr(TMHD)2 and Ti-isopropoxide were used as Sr and Ti metal organic sources, respectively. Perovskite SrTiO3 films were obtained at relatively low temperature of 500°C using ECR oxygen plasma. Experimental results indicated that higher deposition temperature and ECR oxygen plasma increase the crystallinity, the dielectric constant and the leakage current density. The dielectric constant and the dielectric loss were 222 and 0.04, respectively, for 1234 angstrom thin SrTiO3 film (Sr/(Sr+Ti)=0.5). The leakage current density was 3.78 × 10-7 A/cm2 at 1.0V, and the dielectric breakdown field was 0.57MV/cm. SEM analyses showed that SrTiO3 films have a uniform and fine grain structure. In terms of step coverage, a lateral step coverage of 50% at 0.8μm step (the aspect ratio was 1) was obtained with the thickness uniformity of ±0.5% and the composition uniformity of ±1.2% at 4″ wafer.
Original language | English |
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Pages (from-to) | 183-188 |
Number of pages | 6 |
Journal | Materials Research Society Symposium - Proceedings |
Volume | 415 |
Publication status | Published - 1996 |
Externally published | Yes |
Event | Proceedings of the 1995 MRS Fall Meeting - Boston, MA, USA Duration: 1995 Nov 26 → 1995 Dec 1 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering