Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles

Youngman Kim; Jae Chul Lee

doi:10.1016/j.msea.2005.12.032

Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles

Youngman Kim, Jae Chul Lee

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

32 Citations (Scopus)

Abstract

The SiC powder with a SiO₂ protective layer is used as the reinforcements for 2014 Al/SiC_p composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiC_p composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO₂ layer. The interfacial product was found to be Mg spinel (MgAl₂O₄) formed mainly by the chemical reactions of the SiO₂ layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO₂ oxidation layer, which were processed within 2014 Al alloy.

Original language	English
Pages (from-to)	8-12
Number of pages	5
Journal	Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Volume	420
Issue number	1-2
DOIs	https://doi.org/10.1016/j.msea.2005.12.032
Publication status	Published - 2006 Mar 25

Keywords

Hot pressing
Interfacial bonding
Interfacial reactions
Metal matrix composite

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.msea.2005.12.032

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title = "Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles",

abstract = "The SiC powder with a SiO2 protective layer is used as the reinforcements for 2014 Al/SiCp composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiCp composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO2 layer. The interfacial product was found to be Mg spinel (MgAl2O4) formed mainly by the chemical reactions of the SiO2 layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO2 oxidation layer, which were processed within 2014 Al alloy.",

keywords = "Hot pressing, Interfacial bonding, Interfacial reactions, Metal matrix composite",

author = "Youngman Kim and Lee, {Jae Chul}",

note = "Funding Information: The financial support of ERC (CAPST) fund from Korea Science and Engineering Foundation (KOSEF) is gratefully acknowledged. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.",

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doi = "10.1016/j.msea.2005.12.032",

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AU - Kim, Youngman

AU - Lee, Jae Chul

N1 - Funding Information: The financial support of ERC (CAPST) fund from Korea Science and Engineering Foundation (KOSEF) is gratefully acknowledged. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.

PY - 2006/3/25

Y1 - 2006/3/25

N2 - The SiC powder with a SiO2 protective layer is used as the reinforcements for 2014 Al/SiCp composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiCp composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO2 layer. The interfacial product was found to be Mg spinel (MgAl2O4) formed mainly by the chemical reactions of the SiO2 layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO2 oxidation layer, which were processed within 2014 Al alloy.

AB - The SiC powder with a SiO2 protective layer is used as the reinforcements for 2014 Al/SiCp composites to suppress the reaction between the Al matrix and the SiC particle. 2014 Al/SiCp composites were fabricated by vacuum hot pressing (VHP) and subsequent extrusion using 2014 Al powders and the SiC particles covered with a SiO2 layer. The interfacial product was found to be Mg spinel (MgAl2O4) formed mainly by the chemical reactions of the SiO2 layer covered on SiC particles with the Mg, Al in the 2014 Al alloy matrix. Also the interfacial bonding strength of the composites was investigated using push-out tests of SiC rods with the SiO2 oxidation layer, which were processed within 2014 Al alloy.

KW - Hot pressing

KW - Interfacial bonding

KW - Interfacial reactions

KW - Metal matrix composite

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Processing and interfacial bonding strength of 2014 Al matrix composites reinforced with oxidized SiC particles

Abstract

Keywords

ASJC Scopus subject areas

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