Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method

Sang Jong Kim; Chong Yun Kang; Ji Won Choi; Dal Young Kim; Man Young Sung; Hyun Jai Kim; Seok Jin Yoon

doi:10.1016/j.matchemphys.2004.09.038

Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method

Sang Jong Kim, Chong Yun Kang, Ji Won Choi, Dal Young Kim, Man Young Sung, Hyun Jai Kim, Seok Jin Yoon

Research output: Contribution to journal › Review article › peer-review

15 Citations (Scopus)

Abstract

Characteristics of piezoelectric actuator on Si membrane were investigated. Si membranes were fabricated as a function of size using bulk micromachining method. Bottom electrode Ag-Pd and piezoelectric thick films were fabricated using screen printing method, respectively. Piezoelectric thick films were sintered by rapid thermal annealing (RTA). Top electrodes Pt were deposited by DC sputtering system. We analyzed micro structure by scanning electron microscope (SEM) and investigated dynamic properties by MTI2000. Therefore, piezoelectric thick film on Si membrane had P_r of 15.7 μC cm ^-2. The maximum displacement of micro actuator had 0.05 μm. We find the combination of thick film printing and MEMS process to form a Si membrane micro actuator.

Original language	English
Pages (from-to)	401-404
Number of pages	4
Journal	Materials Chemistry and Physics
Volume	90
Issue number	2-3
DOIs	https://doi.org/10.1016/j.matchemphys.2004.09.038
Publication status	Published - 2005 Apr 15

Keywords

Bulk micromachining
Piezoelectric actuator
Screen printing method

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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10.1016/j.matchemphys.2004.09.038

Cite this

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title = "Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method",

abstract = "Characteristics of piezoelectric actuator on Si membrane were investigated. Si membranes were fabricated as a function of size using bulk micromachining method. Bottom electrode Ag-Pd and piezoelectric thick films were fabricated using screen printing method, respectively. Piezoelectric thick films were sintered by rapid thermal annealing (RTA). Top electrodes Pt were deposited by DC sputtering system. We analyzed micro structure by scanning electron microscope (SEM) and investigated dynamic properties by MTI2000. Therefore, piezoelectric thick film on Si membrane had Pr of 15.7 μC cm -2. The maximum displacement of micro actuator had 0.05 μm. We find the combination of thick film printing and MEMS process to form a Si membrane micro actuator.",

keywords = "Bulk micromachining, Piezoelectric actuator, Screen printing method",

author = "Kim, {Sang Jong} and Kang, {Chong Yun} and Choi, {Ji Won} and Kim, {Dal Young} and Sung, {Man Young} and Kim, {Hyun Jai} and Yoon, {Seok Jin}",

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doi = "10.1016/j.matchemphys.2004.09.038",

language = "English",

volume = "90",

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journal = "Materials Chemistry and Physics",

issn = "0254-0584",

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TY - JOUR

T1 - Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method

AU - Kim, Sang Jong

AU - Kang, Chong Yun

AU - Choi, Ji Won

AU - Kim, Dal Young

AU - Sung, Man Young

AU - Kim, Hyun Jai

AU - Yoon, Seok Jin

PY - 2005/4/15

Y1 - 2005/4/15

N2 - Characteristics of piezoelectric actuator on Si membrane were investigated. Si membranes were fabricated as a function of size using bulk micromachining method. Bottom electrode Ag-Pd and piezoelectric thick films were fabricated using screen printing method, respectively. Piezoelectric thick films were sintered by rapid thermal annealing (RTA). Top electrodes Pt were deposited by DC sputtering system. We analyzed micro structure by scanning electron microscope (SEM) and investigated dynamic properties by MTI2000. Therefore, piezoelectric thick film on Si membrane had Pr of 15.7 μC cm -2. The maximum displacement of micro actuator had 0.05 μm. We find the combination of thick film printing and MEMS process to form a Si membrane micro actuator.

AB - Characteristics of piezoelectric actuator on Si membrane were investigated. Si membranes were fabricated as a function of size using bulk micromachining method. Bottom electrode Ag-Pd and piezoelectric thick films were fabricated using screen printing method, respectively. Piezoelectric thick films were sintered by rapid thermal annealing (RTA). Top electrodes Pt were deposited by DC sputtering system. We analyzed micro structure by scanning electron microscope (SEM) and investigated dynamic properties by MTI2000. Therefore, piezoelectric thick film on Si membrane had Pr of 15.7 μC cm -2. The maximum displacement of micro actuator had 0.05 μm. We find the combination of thick film printing and MEMS process to form a Si membrane micro actuator.

KW - Bulk micromachining

KW - Piezoelectric actuator

KW - Screen printing method

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U2 - 10.1016/j.matchemphys.2004.09.038

DO - 10.1016/j.matchemphys.2004.09.038

M3 - Review article

AN - SCOPUS:13144254275

SN - 0254-0584

VL - 90

SP - 401

EP - 404

JO - Materials Chemistry and Physics

JF - Materials Chemistry and Physics

IS - 2-3

ER -

Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method

Abstract

Keywords

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