Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method

Jong Seok Kim, Sang Woo Lee, Kyu Dong Jung, Woon Bae Kim, Sung Hoon Choa, Byeong Kwon Ju

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

A micro-machined gyro chip of gyroscope is normally packaged in specific vacuum level to get the specific quality factor(Q-factor). If the Q-factor is too high, frequency tuning and the approximate matching between driving and sensing comb structure become difficult, and if the Q-factor is too low, its sensitivity decreases. The optimum Q-factor of our gyro chip design is 4000 range. To get this range, we measured the drive mode Q-factor as vacuum level of our gyro chip and we found that the vacuum level of the desired Q-factor 4000 is in the range of 740 mTorr. Based on this data, we fabricate the wafer level package gyro chip of the desired Q-factor by controlled the basic pressure of package bonding chamber just prior to the bonding process. After wafer level package process, we measured Q-factor of whole samples. Among 804 samples, 502 packaged gyro chips are worked and the Q-factor of 67% samples is between 3500 and 4500 range.

Original languageEnglish
Pages (from-to)948-952
Number of pages5
JournalMicroelectronics Reliability
Volume48
Issue number6
DOIs
Publication statusPublished - 2008 Jun

Bibliographical note

Funding Information:
This Project was supported by the dedicated work of MEMS reliability team, MEMS gyroscope group in Nano Fabrication Center and MEMS laboratory of Samsung Advanced Institute of Technology.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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