Abstract
In semiconductor manufacturing, accurate prediction of electrical test (ET) parameters is essential for optimizing wafer quality and production efficiency. Traditional machine learning approaches rely on hard-to-obtain metrology data or handcrafted features, limiting scalability and practical applicability. In this work, we propose a deep learning framework that predicts multiple ET parameters using only readily available fabrication (FAB) process data. Our approach addresses two fundamental challenges: the categorical and sequential nature of FAB process data and the inherent range imbalance across ET parameters. We propose a feature extraction architecture that combines an input projection layer for handling categorical data with a one-dimensional convolutional neural network-based feature extractor designed to capture sequential patterns in FAB processes. To ensure balanced optimization across ET parameters with varying ranges, we introduce a range-aware loss function that assigns parameter-specific weights based on their value range. Experimental results on real-world semiconductor manufacturing data demonstrate that our proposed method achieves superior prediction accuracy compared to conventional methods, validating our framework's effectiveness in practical semiconductor manufacturing environments.
| Original language | English |
|---|---|
| Title of host publication | 2025 IEEE 21st International Conference on Automation Science and Engineering, CASE 2025 |
| Publisher | IEEE Computer Society |
| Pages | 1195-1200 |
| Number of pages | 6 |
| ISBN (Electronic) | 9798331522469 |
| DOIs | |
| Publication status | Published - 2025 |
| Event | 21st IEEE International Conference on Automation Science and Engineering, CASE 2025 - Los Angeles, United States Duration: 2025 Aug 17 → 2025 Aug 21 |
Publication series
| Name | IEEE International Conference on Automation Science and Engineering |
|---|---|
| ISSN (Print) | 2161-8070 |
| ISSN (Electronic) | 2161-8089 |
Conference
| Conference | 21st IEEE International Conference on Automation Science and Engineering, CASE 2025 |
|---|---|
| Country/Territory | United States |
| City | Los Angeles |
| Period | 25/8/17 → 25/8/21 |
Bibliographical note
Publisher Copyright:© 2025 IEEE.
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering
Fingerprint
Dive into the research topics of 'Range-Aware Deep Learning Framework for Multi-Parameter Electrical Test Prediction in Semiconductor Manufacturing'. Together they form a unique fingerprint.Cite this
- APA
- Standard
- Harvard
- Vancouver
- Author
- BIBTEX
- RIS