Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration

Seok Hwan Lee; Heun Young Seo; Yong Sik Yeom; Jong Eun Kim; Heseong An; Jong Suk Lee; Hae Kwon Jeong; Kyung Youl Baek; Kie Yong Cho; Ho Gyu Yoon

doi:10.1016/j.polymer.2018.05.062

Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration

Seok Hwan Lee, Heun Young Seo, Yong Sik Yeom, Jong Eun Kim, Heseong An, Jong Suk Lee, Hae Kwon Jeong, Kyung Youl Baek, Kie Yong Cho, Ho Gyu Yoon

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn²⁺ and Cu²⁺) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu²⁺ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

Original language	English
Pages (from-to)	159-168
Number of pages	10
Journal	Polymer
Volume	150
DOIs	https://doi.org/10.1016/j.polymer.2018.05.062
Publication status	Published - 2018 Aug 15

Bibliographical note

Funding Information:
This work was supported by Nano Material Technology Development Program (Project No. 2016M3A7B4027805 ) and C1 Gas Refinery Program (Project No. 2017M3D3A1A01037006 ) through the National Research Foundation of Korea funded by the Ministry of Science, ICT, and Future Planning , and partially supported through a grant from Korea University .

Publisher Copyright:
© 2018 Elsevier Ltd

Keywords

Copper migration suppression
Epoxy nanocomposites
ZIF-8

ASJC Scopus subject areas

Organic Chemistry
Polymers and Plastics
Materials Chemistry

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10.1016/j.polymer.2018.05.062

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title = "Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration",

abstract = "Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.",

keywords = "Copper migration suppression, Epoxy nanocomposites, ZIF-8",

author = "Lee, {Seok Hwan} and Seo, {Heun Young} and Yeom, {Yong Sik} and Kim, {Jong Eun} and Heseong An and Lee, {Jong Suk} and Jeong, {Hae Kwon} and Baek, {Kyung Youl} and Cho, {Kie Yong} and Yoon, {Ho Gyu}",

note = "Funding Information: This work was supported by Nano Material Technology Development Program (Project No. 2016M3A7B4027805 ) and C1 Gas Refinery Program (Project No. 2017M3D3A1A01037006 ) through the National Research Foundation of Korea funded by the Ministry of Science, ICT, and Future Planning , and partially supported through a grant from Korea University . Publisher Copyright: {\textcopyright} 2018 Elsevier Ltd",

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doi = "10.1016/j.polymer.2018.05.062",

language = "English",

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AU - Lee, Seok Hwan

AU - Seo, Heun Young

AU - Yeom, Yong Sik

AU - Kim, Jong Eun

AU - An, Heseong

AU - Lee, Jong Suk

AU - Jeong, Hae Kwon

AU - Baek, Kyung Youl

AU - Cho, Kie Yong

AU - Yoon, Ho Gyu

N1 - Funding Information: This work was supported by Nano Material Technology Development Program (Project No. 2016M3A7B4027805 ) and C1 Gas Refinery Program (Project No. 2017M3D3A1A01037006 ) through the National Research Foundation of Korea funded by the Ministry of Science, ICT, and Future Planning , and partially supported through a grant from Korea University . Publisher Copyright: © 2018 Elsevier Ltd

PY - 2018/8/15

Y1 - 2018/8/15

N2 - Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

AB - Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications.

KW - Copper migration suppression

KW - Epoxy nanocomposites

KW - ZIF-8

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JO - Polymer

JF - Polymer

ER -

Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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