Abstract
The PCB inspection system presented in this paper can detect defects including the breaks in the wires and short circuit and is significantly faster when compared to the existing techniques. The proposed inspection method is based on referential matching between the stored reference image and the test (observed) image. Block matching is performed to solve the misalignment in referential matching. In order to reduce the computational complexity, we implement the proposed algorithm using the Single Instruction Multiple Data (SIMD) instructions, so called SSE2.
| Original language | English |
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| Pages | 166-170 |
| Number of pages | 5 |
| Publication status | Published - 2001 |
| Event | 2001 IEEE International Symposium on Industrial Electronics Proceedings (ISIE 2001) - Pusan, Korea, Republic of Duration: 2001 Jun 12 → 2001 Jun 16 |
Other
| Other | 2001 IEEE International Symposium on Industrial Electronics Proceedings (ISIE 2001) |
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| Country/Territory | Korea, Republic of |
| City | Pusan |
| Period | 01/6/12 → 01/6/16 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering