Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing

Priyesh V. More; Sunho Jeong; Yeong Hui Seo; Seong Jip Kim; Sahn Nahm; Beyong Hwan Ryu; Youngmin Choi

doi:10.1063/1.4849245

Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing

Priyesh V. More, Sunho Jeong, Yeong Hui Seo, Seong Jip Kim, Sahn Nahm, Beyong Hwan Ryu, Youngmin Choi

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Highly dispersed and stable silicon nanoparticles ink is formulated for its application in direct printing or printable electronics. These dispersions are prepared from free-standing silicon nanoparticles which are not capped with any organic ligand, making it suitable for electronic applications. Silicon nanoparticles dispersions are prepared by suspending the nanoparticles in benzonitrile or ethanol by using polypropylene glycol (PPG) as a binder. All the samples show typical shear thinning behavior while the dispersion samples show low viscosities signifying good quality dispersion. Such thinning behavior favors in fabrication of dense films with spin-coating or patterns with drop casting. The dispersion stability is monitored by turbiscan measurements showing good stability for one week. A low-cost direct printing method for dispersion samples is also demonstrated to obtain micro-sized patterns. Low electrical resistivity of resulting patterns, adjustable viscosity and good stability makes these silicon nanoparticles dispersions highly applicable for direct printing process.

Original language	English
Title of host publication	3rd International Advances in Applied Physics and Materials Science Congress
Editors	Asli Sonmez, Zehra Banu Bahsi, Ahmet Yavuz Oral
Publisher	American Institute of Physics Inc.
Pages	141-145
Number of pages	5
ISBN (Electronic)	9780735411975
DOIs	https://doi.org/10.1063/1.4849245
Publication status	Published - 2013
Event	3rd International Advances in Applied Physics and Materials Science Congress, APMAS 2013 - Antalya, Turkey Duration: 2013 Apr 24 → 2013 Apr 28

Publication series

Name	AIP Conference Proceedings
Volume	1569
ISSN (Print)	0094-243X
ISSN (Electronic)	1551-7616

Other

Other	3rd International Advances in Applied Physics and Materials Science Congress, APMAS 2013
Country/Territory	Turkey
City	Antalya
Period	13/4/24 → 13/4/28

Bibliographical note

Publisher Copyright:
© 2013 AIP Publishing LLC.

Keywords

Silicon nanoparticles
direct-printing
dispersion stability
ink
resistivity
turbiscan
viscosity

ASJC Scopus subject areas

Physics and Astronomy(all)

Access to Document

10.1063/1.4849245

Cite this

More, P. V., Jeong, S., Seo, Y. H., Kim, S. J., Nahm, S., Ryu, B. H., & Choi, Y. (2013). Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing. In A. Sonmez, Z. B. Bahsi, & A. Y. Oral (Eds.), 3rd International Advances in Applied Physics and Materials Science Congress (pp. 141-145). (AIP Conference Proceedings; Vol. 1569). American Institute of Physics Inc.. https://doi.org/10.1063/1.4849245

Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing. / More, Priyesh V.; Jeong, Sunho; Seo, Yeong Hui et al.
3rd International Advances in Applied Physics and Materials Science Congress. ed. / Asli Sonmez; Zehra Banu Bahsi; Ahmet Yavuz Oral. American Institute of Physics Inc., 2013. p. 141-145 (AIP Conference Proceedings; Vol. 1569).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

More, PV, Jeong, S, Seo, YH, Kim, SJ, Nahm, S, Ryu, BH & Choi, Y 2013, Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing. in A Sonmez, ZB Bahsi & AY Oral (eds), 3rd International Advances in Applied Physics and Materials Science Congress. AIP Conference Proceedings, vol. 1569, American Institute of Physics Inc., pp. 141-145, 3rd International Advances in Applied Physics and Materials Science Congress, APMAS 2013, Antalya, Turkey, 13/4/24. https://doi.org/10.1063/1.4849245

More PV, Jeong S, Seo YH, Kim SJ, Nahm S, Ryu BH et al. Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing. In Sonmez A, Bahsi ZB, Oral AY, editors, 3rd International Advances in Applied Physics and Materials Science Congress. American Institute of Physics Inc. 2013. p. 141-145. (AIP Conference Proceedings). doi: 10.1063/1.4849245

More, Priyesh V. ; Jeong, Sunho ; Seo, Yeong Hui et al. / Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing. 3rd International Advances in Applied Physics and Materials Science Congress. editor / Asli Sonmez ; Zehra Banu Bahsi ; Ahmet Yavuz Oral. American Institute of Physics Inc., 2013. pp. 141-145 (AIP Conference Proceedings).

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Rheology and stability kinetics of bare silicon nanoparticle inks for low-cost direct printing

Abstract

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Keywords

ASJC Scopus subject areas

Access to Document

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