Scaling down of amorphous indium gallium zinc oxide thin film transistors on the polyethersulfone substrate employing the protection layer of parylene-C for the large-scale integration

Seongpil Chang, Ki Young Dong, Jung Ho Park, Tae Yeon Oh, Jong Woo Kim, Sang Yeol Lee, Byeong Kwon Ju

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

We have investigated the parylene-groups for the device scaling-down as the protection layer of polyethersulfone (PES) substrate. In general, photolithography process on the PES substrate could not be allowed due to its poor chemical resistance. In this work, parylene-C is used as the protection layer. However, adhesion problem is observed caused by the hydrophobic property of parylene-groups. Thereby we additionally used SiO2 as the adhesion layer. Finally, we demonstrated the scaling-down of amorphous indium gallium zinc oxide thin film transistor on a plastic substrate by using lithography technique. Field-effect mobility, threshold voltage, current on-to-off ratio are measured to be 0.84 cm2 /V s, 19.7 V, and 7.62× 10 4, respectively.

Original languageEnglish
Article number243504
JournalApplied Physics Letters
Volume96
Issue number24
DOIs
Publication statusPublished - 2010 Jun 14

Bibliographical note

Funding Information:
This work was supported by the IT R&D program of MKE/KEIT (K1002182, TFT backplane technology for next generation display), the world class university (WCU, R32-2008-000-10082-0) project of the ministry of education, science and technology (Korea Science and Engineering Foundation), and the Industrial-Educational Cooperation Program between Korea University and LG Display.

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Fingerprint

Dive into the research topics of 'Scaling down of amorphous indium gallium zinc oxide thin film transistors on the polyethersulfone substrate employing the protection layer of parylene-C for the large-scale integration'. Together they form a unique fingerprint.

Cite this