Secondary bonding of CF/PEKK thermoplastic composites with a PEI film adhesive in a press welding process

Hyunseok Choi; Woo Chun Choi; Seung Ok Son; Youngjun Jeon; Dongearn Kim

doi:10.1142/S021798492340016X

Secondary bonding of CF/PEKK thermoplastic composites with a PEI film adhesive in a press welding process

Hyunseok Choi, Woo Chun Choi, Seung Ok Son, Youngjun Jeon, Dongearn Kim

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

High-performance poly-ether-ketone-ketone (PEKK) thermoplastic (TP) composites, which are beginning to gain interest in the aerospace industry, require a joining procedure to integrate the individual parts. Amorphous TP bonding has been recently proposed to address the limitations of commonly used joining techniques for composites, such as mechanical fastening and adhesive bonding. In this study, we investigated the adhesive properties of a polyetherimide (PEI) film applied by hot press welding as an amorphous polymer interlayer of PEKK laminate. The temperature range of the bonding process was determined via differential scanning calorimetry analysis. The bonding strength was evaluated through single-lap shear tests. The effect of process temperature on the bonding strength was qualitatively analyzed via fracture surface morphology analysis. The interface between PEKK and PEI was analyzed via optical microscopy. The adhesive strength was as low as about 5 MPa up to the bonding temperature of 280°C but then started to improve as the temperature increased, which is attributed to the interdiffusion of the PEKK matrix and PEI adhesive film. The maximum bonding strength of 23 MPa was confirmed at a bonding temperature of 340°C. A mixed failure mode consisting of a relatively high ratio of fiber-tear failure to light-fiber-tear failure is observed at this process temperature. This failure mode can be attributed to the bonding temperature condition at which PEKK begins to melt.

Original language	English
Article number	2340016
Journal	Modern Physics Letters B
Volume	37
Issue number	17
DOIs	https://doi.org/10.1142/S021798492340016X
Publication status	Published - 2023 Jun 20

Bibliographical note

Funding Information:
This work was supported by the Technology Innovation Program (No. 20007444) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea). The sponsors had no involvement in the study design; in the collection, analysis, or interpretation of data; in the writing of the report; or in the decision to submit the article for publication.

Publisher Copyright:
© 2023 World Scientific Publishing Company.

Keywords

Carbon fiber reinforced thermoplastic
bonding strength
polyetherimide
polyetherketoneketone
press welding
secondary bonding

ASJC Scopus subject areas

Condensed Matter Physics
Statistical and Nonlinear Physics

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10.1142/S021798492340016X

Cite this

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title = "Secondary bonding of CF/PEKK thermoplastic composites with a PEI film adhesive in a press welding process",

abstract = "High-performance poly-ether-ketone-ketone (PEKK) thermoplastic (TP) composites, which are beginning to gain interest in the aerospace industry, require a joining procedure to integrate the individual parts. Amorphous TP bonding has been recently proposed to address the limitations of commonly used joining techniques for composites, such as mechanical fastening and adhesive bonding. In this study, we investigated the adhesive properties of a polyetherimide (PEI) film applied by hot press welding as an amorphous polymer interlayer of PEKK laminate. The temperature range of the bonding process was determined via differential scanning calorimetry analysis. The bonding strength was evaluated through single-lap shear tests. The effect of process temperature on the bonding strength was qualitatively analyzed via fracture surface morphology analysis. The interface between PEKK and PEI was analyzed via optical microscopy. The adhesive strength was as low as about 5 MPa up to the bonding temperature of 280°C but then started to improve as the temperature increased, which is attributed to the interdiffusion of the PEKK matrix and PEI adhesive film. The maximum bonding strength of 23 MPa was confirmed at a bonding temperature of 340°C. A mixed failure mode consisting of a relatively high ratio of fiber-tear failure to light-fiber-tear failure is observed at this process temperature. This failure mode can be attributed to the bonding temperature condition at which PEKK begins to melt.",

keywords = "Carbon fiber reinforced thermoplastic, bonding strength, polyetherimide, polyetherketoneketone, press welding, secondary bonding",

author = "Hyunseok Choi and Choi, {Woo Chun} and Son, {Seung Ok} and Youngjun Jeon and Dongearn Kim",

note = "Funding Information: This work was supported by the Technology Innovation Program (No. 20007444) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea). The sponsors had no involvement in the study design; in the collection, analysis, or interpretation of data; in the writing of the report; or in the decision to submit the article for publication. Publisher Copyright: {\textcopyright} 2023 World Scientific Publishing Company.",

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AU - Choi, Woo Chun

AU - Son, Seung Ok

AU - Jeon, Youngjun

AU - Kim, Dongearn

N1 - Funding Information: This work was supported by the Technology Innovation Program (No. 20007444) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea). The sponsors had no involvement in the study design; in the collection, analysis, or interpretation of data; in the writing of the report; or in the decision to submit the article for publication. Publisher Copyright: © 2023 World Scientific Publishing Company.

PY - 2023/6/20

Y1 - 2023/6/20

N2 - High-performance poly-ether-ketone-ketone (PEKK) thermoplastic (TP) composites, which are beginning to gain interest in the aerospace industry, require a joining procedure to integrate the individual parts. Amorphous TP bonding has been recently proposed to address the limitations of commonly used joining techniques for composites, such as mechanical fastening and adhesive bonding. In this study, we investigated the adhesive properties of a polyetherimide (PEI) film applied by hot press welding as an amorphous polymer interlayer of PEKK laminate. The temperature range of the bonding process was determined via differential scanning calorimetry analysis. The bonding strength was evaluated through single-lap shear tests. The effect of process temperature on the bonding strength was qualitatively analyzed via fracture surface morphology analysis. The interface between PEKK and PEI was analyzed via optical microscopy. The adhesive strength was as low as about 5 MPa up to the bonding temperature of 280°C but then started to improve as the temperature increased, which is attributed to the interdiffusion of the PEKK matrix and PEI adhesive film. The maximum bonding strength of 23 MPa was confirmed at a bonding temperature of 340°C. A mixed failure mode consisting of a relatively high ratio of fiber-tear failure to light-fiber-tear failure is observed at this process temperature. This failure mode can be attributed to the bonding temperature condition at which PEKK begins to melt.

AB - High-performance poly-ether-ketone-ketone (PEKK) thermoplastic (TP) composites, which are beginning to gain interest in the aerospace industry, require a joining procedure to integrate the individual parts. Amorphous TP bonding has been recently proposed to address the limitations of commonly used joining techniques for composites, such as mechanical fastening and adhesive bonding. In this study, we investigated the adhesive properties of a polyetherimide (PEI) film applied by hot press welding as an amorphous polymer interlayer of PEKK laminate. The temperature range of the bonding process was determined via differential scanning calorimetry analysis. The bonding strength was evaluated through single-lap shear tests. The effect of process temperature on the bonding strength was qualitatively analyzed via fracture surface morphology analysis. The interface between PEKK and PEI was analyzed via optical microscopy. The adhesive strength was as low as about 5 MPa up to the bonding temperature of 280°C but then started to improve as the temperature increased, which is attributed to the interdiffusion of the PEKK matrix and PEI adhesive film. The maximum bonding strength of 23 MPa was confirmed at a bonding temperature of 340°C. A mixed failure mode consisting of a relatively high ratio of fiber-tear failure to light-fiber-tear failure is observed at this process temperature. This failure mode can be attributed to the bonding temperature condition at which PEKK begins to melt.

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Secondary bonding of CF/PEKK thermoplastic composites with a PEI film adhesive in a press welding process

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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