Self-arrangement of solder balls by using the surface wettability difference

Jong hyeon Chang, Jangwon Hong, James Jungho Pak

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.

Original languageEnglish
Pages (from-to)1283-1286
Number of pages4
JournalMaterials Letters
Issue number11
Publication statusPublished - 2010 Jun 15


  • Self-arrangement
  • Solder balls
  • Surface wettability

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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