Self-arrangement of solder balls by using the surface wettability difference

Jong hyeon Chang; Jangwon Hong; James Jungho Pak

doi:10.1016/j.matlet.2010.03.009

Self-arrangement of solder balls by using the surface wettability difference

Jong hyeon Chang, Jangwon Hong, James Jungho Pak

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.

Original language	English
Pages (from-to)	1283-1286
Number of pages	4
Journal	Materials Letters
Volume	64
Issue number	11
DOIs	https://doi.org/10.1016/j.matlet.2010.03.009
Publication status	Published - 2010 Jun 15

Keywords

Self-arrangement
Solder balls
Surface wettability

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1016/j.matlet.2010.03.009

Cite this

@article{eaa2f2fdde3942fa9971f3383a5228bd,

title = "Self-arrangement of solder balls by using the surface wettability difference",

abstract = "This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.",

keywords = "Self-arrangement, Solder balls, Surface wettability",

author = "Chang, {Jong hyeon} and Jangwon Hong and Pak, {James Jungho}",

year = "2010",

month = jun,

day = "15",

doi = "10.1016/j.matlet.2010.03.009",

language = "English",

volume = "64",

pages = "1283--1286",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier B.V.",

number = "11",

}

TY - JOUR

T1 - Self-arrangement of solder balls by using the surface wettability difference

AU - Chang, Jong hyeon

AU - Hong, Jangwon

AU - Pak, James Jungho

PY - 2010/6/15

Y1 - 2010/6/15

N2 - This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.

AB - This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3 × 3, 4 × 4, and 5 × 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251 MPa, respectively.

KW - Self-arrangement

KW - Solder balls

KW - Surface wettability

UR - http://www.scopus.com/inward/record.url?scp=77950516419&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950516419&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2010.03.009

DO - 10.1016/j.matlet.2010.03.009

M3 - Article

AN - SCOPUS:77950516419

SN - 0167-577X

VL - 64

SP - 1283

EP - 1286

JO - Materials Letters

JF - Materials Letters

IS - 11

ER -

Self-arrangement of solder balls by using the surface wettability difference

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this