Simple signal path technique for matching circuit in packaged semiconductor diode laser

J. H. Han

doi:10.2478/s11772-008-0002-7

Simple signal path technique for matching circuit in packaged semiconductor diode laser

Research output: Contribution to journal › Article › peer-review

Abstract

Improvement in frequency bandwidth of a packaged diode laser is investigated by the circuit impedance matching. To overcome the structural limitation of the electronic package for high frequencies, employing conventional lumped element impedance matching technique in conjunction with the manipulation of signal path of the package connections showed significant enhancement for 3-dB bandwidth to more than 6 GHz.

Original language	English
Pages (from-to)	185-188
Number of pages	4
Journal	Opto-Electronics Review
Volume	16
Issue number	2
DOIs	https://doi.org/10.2478/s11772-008-0002-7
Publication status	Published - 2008 Mar
Externally published	Yes

Keywords

Bandwidth
Circuit modelling
Device packaging
Diode laser
Frequency response

ASJC Scopus subject areas

Radiation
General Materials Science
Electrical and Electronic Engineering

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10.2478/s11772-008-0002-7

Cite this

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title = "Simple signal path technique for matching circuit in packaged semiconductor diode laser",

abstract = "Improvement in frequency bandwidth of a packaged diode laser is investigated by the circuit impedance matching. To overcome the structural limitation of the electronic package for high frequencies, employing conventional lumped element impedance matching technique in conjunction with the manipulation of signal path of the package connections showed significant enhancement for 3-dB bandwidth to more than 6 GHz.",

keywords = "Bandwidth, Circuit modelling, Device packaging, Diode laser, Frequency response",

author = "Han, {J. H.}",

year = "2008",

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doi = "10.2478/s11772-008-0002-7",

language = "English",

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AB - Improvement in frequency bandwidth of a packaged diode laser is investigated by the circuit impedance matching. To overcome the structural limitation of the electronic package for high frequencies, employing conventional lumped element impedance matching technique in conjunction with the manipulation of signal path of the package connections showed significant enhancement for 3-dB bandwidth to more than 6 GHz.

KW - Bandwidth

KW - Circuit modelling

KW - Device packaging

KW - Diode laser

KW - Frequency response

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JO - Opto-Electronics Review

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Simple signal path technique for matching circuit in packaged semiconductor diode laser

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

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