Abstract
A full software analysis technique for the radio frequency (RF) plasma display panel (PDP) has been developed. The RF PDT test panel has been analyzed by the segmentation/three-dimensional (3-D) parameter extraction/SPICE simulation scheme, which was originally developed for the analysis of RF complimentary metal oxide semiconductor (CMOS) chips. Our technique is shown to be accurate in predicting the input impedance of the RF port and the calculated input impedance is used to perform impedance matching of the system. The technique is also extendable to a much larger size RF-PDP and has the possibility of being applied to the design and analysis of various interesting RF system and components.
Original language | English |
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Pages (from-to) | 279-283 |
Number of pages | 5 |
Journal | IEEE Transactions on Components and Packaging Technologies |
Volume | 24 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2001 Jun |
Keywords
- Impedance matching
- Plasma display panel
- RF
- SPICE
- Software analysis
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering