Solder bump creation by using droplet microgripper for electronic packaging

S. Y. Lee; J. H. Chang; D. Kim; B. K. Ju; J. J. Pak

doi:10.1049/el.2010.0853

Solder bump creation by using droplet microgripper for electronic packaging

S. Y. Lee, J. H. Chang, D. Kim, B. K. Ju, J. J. Pak

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

Original language	English
Pages (from-to)	1336-1338
Number of pages	3
Journal	Electronics Letters
Volume	46
Issue number	19
DOIs	https://doi.org/10.1049/el.2010.0853
Publication status	Published - 2010 Sept 16

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1049/el.2010.0853

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abstract = "A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.",

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AU - Lee, S. Y.

AU - Chang, J. H.

AU - Kim, D.

AU - Ju, B. K.

AU - Pak, J. J.

PY - 2010/9/16

Y1 - 2010/9/16

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AB - A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

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Solder bump creation by using droplet microgripper for electronic packaging

Abstract

ASJC Scopus subject areas

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