Solder bump creation by using droplet microgripper for electronic packaging

S. Y. Lee; J. H. Chang; D. Kim; B. K. Ju; J. J. Pak

doi:10.1049/el.2010.0853

Solder bump creation by using droplet microgripper for electronic packaging

S. Y. Lee^*
, J. H. Chang
, D. Kim
, B. K. Ju
, J. J. Pak

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

Original language	English
Pages (from-to)	1336-1338
Number of pages	3
Journal	Electronics Letters
Volume	46
Issue number	19
DOIs	https://doi.org/10.1049/el.2010.0853
Publication status	Published - 2010 Sept 16

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1049/el.2010.0853

Cite this

@article{cd1ec8928cab444a86ec0b3bd667a8d9,

title = "Solder bump creation by using droplet microgripper for electronic packaging",

abstract = "A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.",

author = "Lee, \{S. Y.\} and Chang, \{J. H.\} and D. Kim and Ju, \{B. K.\} and Pak, \{J. J.\}",

year = "2010",

month = sep,

day = "16",

doi = "10.1049/el.2010.0853",

language = "English",

volume = "46",

pages = "1336--1338",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "John Wiley \& Sons Inc.",

number = "19",

}

TY - JOUR

T1 - Solder bump creation by using droplet microgripper for electronic packaging

AU - Lee, S. Y.

AU - Chang, J. H.

AU - Kim, D.

AU - Ju, B. K.

AU - Pak, J. J.

PY - 2010/9/16

Y1 - 2010/9/16

N2 - A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

AB - A simple and effective method to create solder bumps by using a droplet microgripper for electronic packaging is described. A reusable droplet microgripper was realised simply by patterning a Teflon amorphous fluoropolymer on a glass substrate to make a 5×5 hydrophilic opening site array of 300m-diameter circles and 600m pitches. The microgripper was used to self-arrange solder balls of 300m diameter on its wetted sites. After transferring the solder balls to a flux-coated soldering substrate by an alignment process, solder bumps were successfully created on the corresponding solder ball lands through a reflow process.

UR - https://www.scopus.com/pages/publications/77956830756

UR - https://www.scopus.com/pages/publications/77956830756#tab=citedBy

U2 - 10.1049/el.2010.0853

DO - 10.1049/el.2010.0853

M3 - Article

AN - SCOPUS:77956830756

SN - 0013-5194

VL - 46

SP - 1336

EP - 1338

JO - Electronics Letters

JF - Electronics Letters

IS - 19

ER -

Solder bump creation by using droplet microgripper for electronic packaging

Abstract

ASJC Scopus subject areas

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