Stochastic Feed-forward Attention Mechanism for Reliable Defect Classification and Interpretation

  • Jiyoon Lee
  • , Chunghyup Mok
  • , Sanghoon Kim
  • , Seokho Moon
  • , Seo Yeon Kim
  • , Seoung Bum Kim*
  • *Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Defect analysis in manufacturing systems has been crucial for reducing product defect rates and improving process management efficiency. Recently, deep learning algorithms have been widely used to extract significant features from intertwined and complicated manufacturing systems. However, typical deep learning algorithms are black-box models in which the prediction process is difficult to understand. In this study, we propose a stochastic feed-forward attention network that consists of input feature level attention. The stochastic feed-forward attention network allows us to interpret the model by identifying the input features, dominant for prediction. In addition, the proposed model uses variational inferences to yield uncertainty information, which is a measure of the reliability of the interpretations. We conducted experiments in the field of display electrostatic chuck fabrication process to demonstrate the effectiveness and usefulness of our method. The results confirmed that our proposed method performs better and can reflect important input features.

    Original languageEnglish
    Title of host publicationIntelligent Systems and Applications - Proceedings of the 2022 Intelligent Systems Conference IntelliSys Volume 1
    EditorsKohei Arai
    PublisherSpringer Science and Business Media Deutschland GmbH
    Pages148-158
    Number of pages11
    ISBN (Print)9783031160714
    DOIs
    Publication statusPublished - 2023
    EventIntelligent Systems Conference, IntelliSys 2022 - Virtual, Online
    Duration: 2022 Sept 12022 Sept 2

    Publication series

    NameLecture Notes in Networks and Systems
    Volume542 LNNS
    ISSN (Print)2367-3370
    ISSN (Electronic)2367-3389

    Conference

    ConferenceIntelligent Systems Conference, IntelliSys 2022
    CityVirtual, Online
    Period22/9/122/9/2

    Bibliographical note

    Publisher Copyright:
    © 2023, The Author(s), under exclusive license to Springer Nature Switzerland AG.

    Keywords

    • Bayesian neural network
    • Defect prediction
    • Electrostatic chuck fabrication process
    • Explainable artificial intelligence
    • Feed-forward attention mechanism

    ASJC Scopus subject areas

    • Control and Systems Engineering
    • Signal Processing
    • Computer Networks and Communications

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