Structural Behavior of a Composite Curtain Wall Fabricated by the Fused Deposition Modeling 3D Printing Method

Min Jae Park, Jaehoon Bae, Young K. Ju

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


In this era of the fourth industrial revolution, the integration of big data and 3D printing technology with the construction industry has maximized productivity. Currently, there is an active effort to research the optimal cladding structure through 3D printing technology to reduce production costs. This paper proposes a new type of 3D print curtain wall, using a high-strength ABS-M30 polymer panel, which is stronger than the standard acrylonitrile butadiene styrene (ABS) polymer, as an internally reinforced structure. This structure is fabricated via fused deposition modeling, a 3D printing method, to reduce the weight of the general cement panel. In addition, the shape of the polymer board was designed; three shapes were considered—O, W, and X types—which aided in further reducing the weight of the cladding. After comparing the center deformation of the structure through a lateral load test and finite element method analysis, the optimal model was selected. The measured data of the two methods at a design wind speed of 100% showed a difference of approximately 10%; however, at 150% of the design wind speed, the difference between the two sets of data increased to 27%.

Original languageEnglish
Article number1431
Issue number7
Publication statusPublished - 2022 Apr 1

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (MSIT) (No. NRF-2021R1A5A1032433 and NRF-2020R1A2C3005687). The authors are grateful to the authorities for their support.

Publisher Copyright:
© 2022 by the authors. Licensee MDPI, Basel, Switzerland.


  • ABS-M30
  • FDM 3D printer
  • FEM
  • cement cladding
  • harmony search algorithm

ASJC Scopus subject areas

  • General Chemistry
  • Polymers and Plastics


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