Study on elimination of screening-current-induced field in pancake-type non-insulated HTS coil

K. L. Kim, J. B. Song, D. G. Yang, Y. G. Kim, T. H. Kim, S. K. Kim, M. W. Park, H. G. Lee

    Research output: Contribution to journalArticlepeer-review

    16 Citations (Scopus)

    Abstract

    This paper presents the details of a recent study on the removal of the screening-current-induced field (SCIF) in a pancake-type non-insulated high-temperature superconductor coil (NI coil). To determine the SCIF in the NI coil, the magnetic flux density (B z) was calculated using the equivalent circuit model of the coil and compared to the B z obtained empirically. The experimental results indicate that the SCIF elimination in the NI coil was enhanced upon increasing the amplitude and frequency of the AC current being supplied to the background coil. Moreover, the SCIF in the NI coil was successfully removed by applying the appropriate external AC magnetic field intensity. This is because the magnetization direction of the SCIF changed completely from radial to spiral, a phenomenon termed the 'vortex shaking effect.' Overall, this study confirmed that the SCIF in a pancake-type NI coil can be effectively removed by exposing the coil to an external AC magnetic field.

    Original languageEnglish
    Article number035009
    JournalSuperconductor Science and Technology
    Volume29
    Issue number3
    DOIs
    Publication statusPublished - 2016 Feb 2

    Bibliographical note

    Publisher Copyright:
    © 2016 IOP Publishing Ltd.

    Keywords

    • high temperature superconductor
    • no-insulation
    • pancake coil
    • screening current induced field

    ASJC Scopus subject areas

    • Ceramics and Composites
    • Condensed Matter Physics
    • Metals and Alloys
    • Electrical and Electronic Engineering
    • Materials Chemistry

    Fingerprint

    Dive into the research topics of 'Study on elimination of screening-current-induced field in pancake-type non-insulated HTS coil'. Together they form a unique fingerprint.

    Cite this