Abstract
Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.
Original language | English |
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Pages (from-to) | 157-161 |
Number of pages | 5 |
Journal | Journal of the Korean Ceramic Society |
Volume | 44 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2007 Mar |
Keywords
- Ag paste
- Embedded inductor
- LTCC
- Thick film lithography
ASJC Scopus subject areas
- Ceramics and Composites