Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC

Sang Myoung Lee; Seong Dae Park; Myong Jae Yoo; Woo Sung Lee; Nam Kee Kang; Sahn Nahm

doi:10.4191/KCERS.2007.44.3.157

Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC

Sang Myoung Lee, Seong Dae Park, Myong Jae Yoo, Woo Sung Lee, Nam Kee Kang, Sahn Nahm

Research output: Contribution to journal › Article › peer-review

Abstract

Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

Original language	English
Pages (from-to)	157-161
Number of pages	5
Journal	Journal of the Korean Ceramic Society
Volume	44
Issue number	3
DOIs	https://doi.org/10.4191/KCERS.2007.44.3.157
Publication status	Published - 2007 Mar

Keywords

Ag paste
Embedded inductor
LTCC
Thick film lithography

ASJC Scopus subject areas

Ceramics and Composites

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10.4191/KCERS.2007.44.3.157

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title = "Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC",

abstract = "Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.",

keywords = "Ag paste, Embedded inductor, LTCC, Thick film lithography",

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year = "2007",

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AU - Park, Seong Dae

AU - Yoo, Myong Jae

AU - Lee, Woo Sung

AU - Kang, Nam Kee

AU - Nahm, Sahn

PY - 2007/3

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N2 - Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

AB - Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

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KW - Embedded inductor

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Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC

Abstract

Keywords

ASJC Scopus subject areas

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