TY - JOUR
T1 - Study on the thermo-compression bonding of thermoplastic polyurethane (TPU) plates of significant thickness difference by indentation
AU - Lee, Beop Jong
AU - Kim, Kwon Hee
N1 - Publisher Copyright:
© 2020 The Korean Society of Mechanical Engineers
PY - 2020
Y1 - 2020
N2 - When a thin plate is placed on a thick plate for thermo-compression bonding, unbalanced melting may lead to insufficient bonding. In this study, a heated conical indenter and a set of flat compression dies are adopted to solve this problem. When the indenter is pressed on the combined layers, the thin plate is penetrated first and the indenter progresses into the thick plate up to a predetermined depth. Immediately after the indenter is removed, the melted site is compressed by a set of the flat dies at room temperature; the bonding is complete after cooling. Experiments were conducted to investigate the effects of the process parameters on the bond strength. The major parameters were indenter temperature, duration of indentation, compression load, method of cooling, angle of the indenter, indentation depth, and duration of compression. As a result of the orthogonal array tests, it was confirmed that the indenter temperature has the greatest influence on the bond strength.
AB - When a thin plate is placed on a thick plate for thermo-compression bonding, unbalanced melting may lead to insufficient bonding. In this study, a heated conical indenter and a set of flat compression dies are adopted to solve this problem. When the indenter is pressed on the combined layers, the thin plate is penetrated first and the indenter progresses into the thick plate up to a predetermined depth. Immediately after the indenter is removed, the melted site is compressed by a set of the flat dies at room temperature; the bonding is complete after cooling. Experiments were conducted to investigate the effects of the process parameters on the bond strength. The major parameters were indenter temperature, duration of indentation, compression load, method of cooling, angle of the indenter, indentation depth, and duration of compression. As a result of the orthogonal array tests, it was confirmed that the indenter temperature has the greatest influence on the bond strength.
KW - Design Parameter
KW - Indenter
KW - Orthogonal Array
KW - Thermo-Compression Bonding
UR - http://www.scopus.com/inward/record.url?scp=85084493568&partnerID=8YFLogxK
U2 - 10.3795/KSME-A.2020.44.1.013
DO - 10.3795/KSME-A.2020.44.1.013
M3 - Article
AN - SCOPUS:85084493568
SN - 1226-4873
VL - 44
SP - 13
EP - 19
JO - Transactions of the Korean Society of Mechanical Engineers, A
JF - Transactions of the Korean Society of Mechanical Engineers, A
IS - 1
ER -