TY - GEN
T1 - TEM analysis of multilayered Co/Cu nanowire synthesized by DC electrodeposition
AU - Choi, Soonmee
AU - Cho, Jiung
AU - Kim, Youngkeun
AU - Kim, Cheoljin
PY - 2007
Y1 - 2007
N2 - As-received multilayered Co/Cu nanowire arrays were examined by TEM, which were synthesized by pulsed DC electrodeposition using anodized aluminum oxide (AAO) templates. The multilayered Co/Cu nanowire exhibited magnetism in the perpendicular direction to the long wire axis. These nanowire can be applied to sensor array, magnetic bead(biocompatible), MRI contrast enhancing agent, ferro-fluid. Although the characterization of the multilayered Co/Cu nanowire using XRD and VSM and microstructural analysis using TEM on the bare nanowires extracted from AAO templates have been reported, interface analysis between Co and Cu phase or HREM analysis has not been reported in detail. We have prepared TEM specimen with large thin area which was appropriate for the interface analysis between Co and Cu layer without removing AAO templates using tripod polishing method. Tripod polishing proved very efficient to secure the large observable area during TEM session since the polishing angle can be precisely controlled, regardless of the mechanical strength differences in constituents. Thus we could observe not only the interface between Co and Cu layer but also the interface between the metallic layers and AAO templates. Microstructure, composition, and the concentration variation of each Co and Cu layer and the interfaces were analyzed with TEM and STEM.
AB - As-received multilayered Co/Cu nanowire arrays were examined by TEM, which were synthesized by pulsed DC electrodeposition using anodized aluminum oxide (AAO) templates. The multilayered Co/Cu nanowire exhibited magnetism in the perpendicular direction to the long wire axis. These nanowire can be applied to sensor array, magnetic bead(biocompatible), MRI contrast enhancing agent, ferro-fluid. Although the characterization of the multilayered Co/Cu nanowire using XRD and VSM and microstructural analysis using TEM on the bare nanowires extracted from AAO templates have been reported, interface analysis between Co and Cu phase or HREM analysis has not been reported in detail. We have prepared TEM specimen with large thin area which was appropriate for the interface analysis between Co and Cu layer without removing AAO templates using tripod polishing method. Tripod polishing proved very efficient to secure the large observable area during TEM session since the polishing angle can be precisely controlled, regardless of the mechanical strength differences in constituents. Thus we could observe not only the interface between Co and Cu layer but also the interface between the metallic layers and AAO templates. Microstructure, composition, and the concentration variation of each Co and Cu layer and the interfaces were analyzed with TEM and STEM.
KW - Co/Cu nanowire
KW - Interface analysis
KW - Pulsed DC electrodeposition
KW - STEM
KW - TEM
UR - http://www.scopus.com/inward/record.url?scp=38549151949&partnerID=8YFLogxK
U2 - 10.4028/3-908451-31-0.1233
DO - 10.4028/3-908451-31-0.1233
M3 - Conference contribution
AN - SCOPUS:38549151949
SN - 3908451310
SN - 9783908451310
T3 - Solid State Phenomena
SP - 1233
EP - 1236
BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PB - Trans Tech Publications Ltd
T2 - IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Y2 - 10 September 2006 through 14 September 2006
ER -