Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector

Kiryong Song; Doyoon Kim; Jungsoo Kim; Jai Heon Cho; Jae Sung Rieh

doi:10.1109/RFIT54256.2022.9882487

Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector

Kiryong Song, Doyoon Kim, Jungsoo Kim, Jai Heon Cho, Jae Sung Rieh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.

Original language	English
Title of host publication	RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	239-240
Number of pages	2
ISBN (Electronic)	9781665466493
DOIs	https://doi.org/10.1109/RFIT54256.2022.9882487
Publication status	Published - 2022
Event	2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of Duration: 2022 Aug 29 → 2022 Aug 31

Publication series

Name	RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology

Conference

Conference	2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
Country/Territory	Korea, Republic of
City	Busan
Period	22/8/29 → 22/8/31

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

Keywords

CMOS integrated circuits
Semiconductor detectors
imaging
sensor arrays

ASJC Scopus subject areas

Computer Networks and Communications
Hardware and Architecture
Signal Processing
Electrical and Electronic Engineering
Instrumentation

Access to Document

10.1109/RFIT54256.2022.9882487

Cite this

Song, K., Kim, D., Kim, J., Cho, J. H., & Rieh, J. S. (2022). Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector. In RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology (pp. 239-240). (RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT54256.2022.9882487

Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector. / Song, Kiryong; Kim, Doyoon; Kim, Jungsoo et al.
RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology. Institute of Electrical and Electronics Engineers Inc., 2022. p. 239-240 (RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Song, K, Kim, D, Kim, J, Cho, JH & Rieh, JS 2022, Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector. in RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology. RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology, Institute of Electrical and Electronics Engineers Inc., pp. 239-240, 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022, Busan, Korea, Republic of, 22/8/29. https://doi.org/10.1109/RFIT54256.2022.9882487

Song K, Kim D, Kim J, Cho JH, Rieh JS. Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector. In RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology. Institute of Electrical and Electronics Engineers Inc. 2022. p. 239-240. (RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology). doi: 10.1109/RFIT54256.2022.9882487

Song, Kiryong ; Kim, Doyoon ; Kim, Jungsoo et al. / Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector. RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 239-240 (RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology).

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abstract = "A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.",

keywords = "CMOS integrated circuits, Semiconductor detectors, imaging, sensor arrays",

author = "Kiryong Song and Doyoon Kim and Jungsoo Kim and Cho, {Jai Heon} and Rieh, {Jae Sung}",

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Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector

Abstract

Publication series

Conference

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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