Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector

Kiryong Song, Doyoon Kim, Jungsoo Kim, Jai Heon Cho, Jae Sung Rieh

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.

    Original languageEnglish
    Title of host publicationRFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages239-240
    Number of pages2
    ISBN (Electronic)9781665466493
    DOIs
    Publication statusPublished - 2022
    Event2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of
    Duration: 2022 Aug 292022 Aug 31

    Publication series

    NameRFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology

    Conference

    Conference2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
    Country/TerritoryKorea, Republic of
    CityBusan
    Period22/8/2922/8/31

    Bibliographical note

    Publisher Copyright:
    © 2022 IEEE.

    Keywords

    • CMOS integrated circuits
    • Semiconductor detectors
    • imaging
    • sensor arrays

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Hardware and Architecture
    • Signal Processing
    • Electrical and Electronic Engineering
    • Instrumentation

    Fingerprint

    Dive into the research topics of 'Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector'. Together they form a unique fingerprint.

    Cite this