Abstract
A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.
Original language | English |
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Title of host publication | RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 239-240 |
Number of pages | 2 |
ISBN (Electronic) | 9781665466493 |
DOIs | |
Publication status | Published - 2022 |
Event | 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of Duration: 2022 Aug 29 → 2022 Aug 31 |
Publication series
Name | RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology |
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Conference
Conference | 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 |
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Country/Territory | Korea, Republic of |
City | Busan |
Period | 22/8/29 → 22/8/31 |
Bibliographical note
Publisher Copyright:© 2022 IEEE.
Keywords
- CMOS integrated circuits
- Semiconductor detectors
- imaging
- sensor arrays
ASJC Scopus subject areas
- Computer Networks and Communications
- Hardware and Architecture
- Signal Processing
- Electrical and Electronic Engineering
- Instrumentation