TY - GEN
T1 - Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector
AU - Song, Kiryong
AU - Kim, Doyoon
AU - Kim, Jungsoo
AU - Cho, Jai Heon
AU - Rieh, Jae Sung
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.
AB - A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.
KW - CMOS integrated circuits
KW - Semiconductor detectors
KW - imaging
KW - sensor arrays
UR - http://www.scopus.com/inward/record.url?scp=85139104162&partnerID=8YFLogxK
U2 - 10.1109/RFIT54256.2022.9882487
DO - 10.1109/RFIT54256.2022.9882487
M3 - Conference contribution
AN - SCOPUS:85139104162
T3 - RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
SP - 239
EP - 240
BT - RFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
Y2 - 29 August 2022 through 31 August 2022
ER -