The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition

Bup Ju Jeon; Hyungduk Ko; Jin Hyun; Dongjin Byun; Joong Kee Lee

doi:10.1016/j.tsf.2005.09.095

The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition

Bup Ju Jeon, Hyungduk Ko, Jin Hyun, Dongjin Byun, Joong Kee Lee

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Cu/C:H composite films were prepared on poly ethylene terephthalate (PET) substrate at room temperature by the electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a negative direct current (DC) bias system. The negative DC bias voltage applied around the substrate strongly affected the crystallographic structure and composition as well as the surface roughness of the copper films. The surface resistivity of films decrease sharply as the bias voltage increase up to about 5 μΩ-cm below which the resistivity remains almost constant in the range of - 900 to - 1700 V. Thus, the bias voltage appeared to be a critical deposition parameter for preparing copper films with low resistivity. With interfacial studies of Cu-PET, copper atoms are embedded into the polymer substrate during the growth process. Therefore, Cu/C:H composite films on PET with good interfacial properties could be prepared by ECR-MOCVD coupled with a (-)DC bias system.

Original language	English
Pages (from-to)	395-401
Number of pages	7
Journal	Thin Solid Films
Volume	496
Issue number	2
DOIs	https://doi.org/10.1016/j.tsf.2005.09.095
Publication status	Published - 2006 Feb 21

Bibliographical note

Funding Information:
The authors would like to thank Professor R.R. Hudgins for his review of the manuscript. Research was supported by New Chemical Process Program under contract number M1-0322-00-0001-04-L14-00-001-001.

Keywords

Chemical vapor deposition
Copper
Polyethylene terephthalate
Surface structure

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition. / Jeon, Bup Ju; Ko, Hyungduk; Hyun, Jin et al.
In: Thin Solid Films, Vol. 496, No. 2, 21.02.2006, p. 395-401.

Research output: Contribution to journal › Article › peer-review

@article{51cfa01c120f444fa3006e30abc22d31,

title = "The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition",

abstract = "Cu/C:H composite films were prepared on poly ethylene terephthalate (PET) substrate at room temperature by the electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a negative direct current (DC) bias system. The negative DC bias voltage applied around the substrate strongly affected the crystallographic structure and composition as well as the surface roughness of the copper films. The surface resistivity of films decrease sharply as the bias voltage increase up to about 5 μΩ-cm below which the resistivity remains almost constant in the range of - 900 to - 1700 V. Thus, the bias voltage appeared to be a critical deposition parameter for preparing copper films with low resistivity. With interfacial studies of Cu-PET, copper atoms are embedded into the polymer substrate during the growth process. Therefore, Cu/C:H composite films on PET with good interfacial properties could be prepared by ECR-MOCVD coupled with a (-)DC bias system.",

keywords = "Chemical vapor deposition, Copper, Polyethylene terephthalate, Surface structure",

author = "Jeon, {Bup Ju} and Hyungduk Ko and Jin Hyun and Dongjin Byun and Lee, {Joong Kee}",

note = "Funding Information: The authors would like to thank Professor R.R. Hudgins for his review of the manuscript. Research was supported by New Chemical Process Program under contract number M1-0322-00-0001-04-L14-00-001-001.",

year = "2006",

month = feb,

day = "21",

doi = "10.1016/j.tsf.2005.09.095",

language = "English",

volume = "496",

pages = "395--401",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

number = "2",

}

TY - JOUR

T1 - The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition

AU - Jeon, Bup Ju

AU - Ko, Hyungduk

AU - Hyun, Jin

AU - Byun, Dongjin

AU - Lee, Joong Kee

N1 - Funding Information: The authors would like to thank Professor R.R. Hudgins for his review of the manuscript. Research was supported by New Chemical Process Program under contract number M1-0322-00-0001-04-L14-00-001-001.

PY - 2006/2/21

Y1 - 2006/2/21

N2 - Cu/C:H composite films were prepared on poly ethylene terephthalate (PET) substrate at room temperature by the electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a negative direct current (DC) bias system. The negative DC bias voltage applied around the substrate strongly affected the crystallographic structure and composition as well as the surface roughness of the copper films. The surface resistivity of films decrease sharply as the bias voltage increase up to about 5 μΩ-cm below which the resistivity remains almost constant in the range of - 900 to - 1700 V. Thus, the bias voltage appeared to be a critical deposition parameter for preparing copper films with low resistivity. With interfacial studies of Cu-PET, copper atoms are embedded into the polymer substrate during the growth process. Therefore, Cu/C:H composite films on PET with good interfacial properties could be prepared by ECR-MOCVD coupled with a (-)DC bias system.

AB - Cu/C:H composite films were prepared on poly ethylene terephthalate (PET) substrate at room temperature by the electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a negative direct current (DC) bias system. The negative DC bias voltage applied around the substrate strongly affected the crystallographic structure and composition as well as the surface roughness of the copper films. The surface resistivity of films decrease sharply as the bias voltage increase up to about 5 μΩ-cm below which the resistivity remains almost constant in the range of - 900 to - 1700 V. Thus, the bias voltage appeared to be a critical deposition parameter for preparing copper films with low resistivity. With interfacial studies of Cu-PET, copper atoms are embedded into the polymer substrate during the growth process. Therefore, Cu/C:H composite films on PET with good interfacial properties could be prepared by ECR-MOCVD coupled with a (-)DC bias system.

KW - Chemical vapor deposition

KW - Copper

KW - Polyethylene terephthalate

KW - Surface structure

UR - http://www.scopus.com/inward/record.url?scp=28144451548&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2005.09.095

DO - 10.1016/j.tsf.2005.09.095

M3 - Article

AN - SCOPUS:28144451548

SN - 0040-6090

VL - 496

SP - 395

EP - 401

JO - Thin Solid Films

JF - Thin Solid Films

IS - 2

ER -

The effect of direct current bias on the characteristics of Cu/C:H composite thin films on poly ethylene terephthalate film prepared by electron cyclotron resonance-metal organic chemical vapor deposition

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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