The Impact of an Ultrathin Y2O3 Layer on GeO2 Passivation in Ge MOS Gate Stacks

  • Yujin Seo
  • , Tae In Lee
  • , Chang Mo Yoon
  • , Bo Eun Park
  • , Wan Sik Hwang
  • , Hyungjun Kim
  • , Hyun Yong Yu
  • , Byung Jin Cho*
  • *Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    26 Citations (Scopus)

    Abstract

    This paper investigates the impact of an atomic layer-deposited Y2O3 dielectric on the passivation of a GeO2 layer in GeO2-based Ge gate stacks. The equivalent oxide thickness scalability and thermal stability of the ultrathin Y2O3 layer are evaluated at different Y2O3 thicknesses and annealing conditions in detail. Experimental results show that a Y2O3 layer thickness of 1.0 nm is required to serve as a GeO2 passivation layer while retaining gate-stack performance at 400 °C postdeposition annealing. However, at a higher annealing temperature of 500 °C, the barrier property deteriorates and allows GeO desorption. The proposed gate-stack implies the applicability of a Y2O3 passivation method for further scaled GeO2-based Ge gate stacks.

    Original languageEnglish
    Article number7970127
    Pages (from-to)3303-3307
    Number of pages5
    JournalIEEE Transactions on Electron Devices
    Volume64
    Issue number8
    DOIs
    Publication statusPublished - 2017 Aug

    Bibliographical note

    Publisher Copyright:
    © 1963-2012 IEEE.

    Keywords

    • Germanium
    • germanium oxide
    • metal-oxide-semiconductor (MOS) capacitor
    • yttrium oxide (YO)

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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