The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique

Shin Kun Ryi; Jong Soo Park; Sung Hyun Kim; Sung Chang Hong; Dong Won Kim

doi:10.1016/j.desal.2006.03.302

The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique

Shin Kun Ryi, Jong Soo Park, Sung Hyun Kim, Sung Chang Hong, Dong Won Kim

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	219-221
Number of pages	3
Journal	Desalination
Volume	200
Issue number	1-3
DOIs	https://doi.org/10.1016/j.desal.2006.03.302
Publication status	Published - 2006 Nov 20

Bibliographical note

Funding Information:
The research was performed for the Carbon Dioxide Reduction and Sequestration. R & D Center, one of the 21st Century Frontier R & D Programs funded by the Ministry of Science & Technology of Korea.

Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.

ASJC Scopus subject areas

General Chemistry
General Chemical Engineering
General Materials Science
Water Science and Technology
Mechanical Engineering

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10.1016/j.desal.2006.03.302

Cite this

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title = "The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique",

author = "Ryi, {Shin Kun} and Park, {Jong Soo} and Kim, {Sung Hyun} and Hong, {Sung Chang} and Kim, {Dong Won}",

note = "Funding Information: The research was performed for the Carbon Dioxide Reduction and Sequestration. R & D Center, one of the 21st Century Frontier R & D Programs funded by the Ministry of Science & Technology of Korea. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.",

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AU - Kim, Sung Hyun

AU - Hong, Sung Chang

AU - Kim, Dong Won

N1 - Funding Information: The research was performed for the Carbon Dioxide Reduction and Sequestration. R & D Center, one of the 21st Century Frontier R & D Programs funded by the Ministry of Science & Technology of Korea. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.

PY - 2006/11/20

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JO - Desalination

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IS - 1-3

ER -

The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique

Bibliographical note

ASJC Scopus subject areas

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