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Thermal behavior and morphology of rubber‐modified epoxies
Woo Nyon Kim
, Chan Eon Park
, Charles M. Burns
*
*
Corresponding author for this work
Research output
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Contribution to journal
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Article
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peer-review
9
Citations (Scopus)
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Engineering
Methane
100%
Thermal Behavior
100%
Image Analysis
100%
John Wiley
100%
Micrograph
100%
Cured Resin
100%
Epoxy Material
100%
Cure Time
100%
Hardeners
100%
Keyphrases
Copolymer
100%
Epoxy
100%
Thermal Behavior
100%
Resin
50%
Bisphenol A
50%
Scanning Electron Microscopy
25%
Oven
25%
Methane
25%
Rubber
25%
Curing Reaction
25%
Glass Transition Temperature
25%
Image Analysis
25%
Differential Scanning Calorimetry
25%
Heat of Reaction
25%
Scanning Electron Micrograph
25%
Hardener
25%
Curing Time
25%
Bimodal Distribution
25%
Fast Curing
25%
Resin Formulation
25%
Epoxy Materials
25%
Diaminodiphenylsulfone
25%
Material Science
Copolymer
100%
Scanning Electron Microscopy
25%
Glass Transition Temperature
25%
Differential Scanning Calorimetry
25%
Heat of Reaction
25%