@article{12abeb2644c34f9eb94b20e1d0662f41,
title = "Thermal Modeling and Validation of a Real-World Mobile AP",
keywords = "Mobile Application Processor, Package-on-Package, Temperature, Thermal Modeling",
author = "Gong, {Young Ho} and Yoo, {Jae Jeong} and Chung, {Sung Woo}",
note = "Funding Information: We would like to thank the National Research Foundation of Korea grant funded by the Korea government (MSIP) (No. 2015R1A2A1A15055435 and No. 2014R1A2A1A11054390), Nano Material Technology Development Program through the National Research Foundation of Korea funded by the Ministry of Science, ICT & Future Planning (MSIP) (No. 2015M3A7B7045470), and Korea University.",
year = "2018",
month = feb,
doi = "10.1109/MDAT.2017.2695958",
language = "English",
volume = "35",
pages = "55--62",
journal = "IEEE Design and Test",
issn = "2168-2356",
publisher = "IEEE Computer Society",
number = "1",
}