Thermal stability of spin valves incorporating new amorphous ZrAl alloy films as under and capping layers

Jong Soo Kim, Seong Rae Lee

    Research output: Contribution to journalArticlepeer-review

    2 Citations (Scopus)

    Abstract

    We investigated the thermal stability and interdiffusion behavior of new amorphous ZrAl-based spin valves (SVs) and compared them with similarly structured Ta-based top (T) and bottom (B) SVs. The magneto-resistance (MR) ratios of ZrAlbased T-and B-SVs were enhanced from 8.49 to 9.14% and from 6.91 to 7.54%, respectively. The Ta-based SVs degraded relatively quickly at elevated temperatures because of interlayer diffusion. In contrast, the MR ratio of the ZrAl-based T-SV decreased by only 6.6% (9.14 → 8.54%), while that of the B-SV increased by 2.3% (7.54 → 7.71 %), after annealing at 300°C for 240 min. This result and the Auger electron spectroscopy (AES) depth profile clearly showed that ZrAl-based SVs have high interdiffusion resistance. Transmission electron microscopy (TEM) and atomic force microscopy (AFM) analyses of the root-mean-square (rms) roughness indicated that the ZrAl layer (0.162 nm) has a smoother interface than the Ta layer (0.431 nm). The ZrAl-based SV has a fine, dense microstructure. It resists interdiffusion at elevated temperature and results in superior thermal stability over traditional Ta-based SVs.

    Original languageEnglish
    Pages (from-to)2206-2208
    Number of pages3
    JournalIEEE Transactions on Magnetics
    Volume40
    Issue number4 II
    DOIs
    Publication statusPublished - 2004 Jul

    Bibliographical note

    Funding Information:
    Manuscript received October 15, 2003. This work was supported by the Korea Ministry of Science and Technology under the National Research Laboratory Program. The authors are with the Division of Materials Science and Engineering, Korea University, Seoul 136-701, Korea (e-mail: [email protected]). Digital Object Identifier 10.1109/TMAG.2004.830217

    Keywords

    • Amorphous ZrAl-based spin valves
    • Interdiffusion
    • Thermal stability

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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