Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, B. K. Ju, D. J. Lee, Y. H. Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

    Research output: Contribution to conferencePaperpeer-review

    1 Citation (Scopus)

    Abstract

    Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.

    Original languageEnglish
    Pages42-45
    Number of pages4
    Publication statusPublished - 1998
    EventProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA
    Duration: 1998 Jul 191998 Jul 24

    Other

    OtherProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC
    CityAsheville, NC, USA
    Period98/7/1998/7/24

    ASJC Scopus subject areas

    • Surfaces and Interfaces

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