Abstract
Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.
Original language | English |
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Pages | 42-45 |
Number of pages | 4 |
Publication status | Published - 1998 |
Event | Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA Duration: 1998 Jul 19 → 1998 Jul 24 |
Other
Other | Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC |
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City | Asheville, NC, USA |
Period | 98/7/19 → 98/7/24 |
ASJC Scopus subject areas
- Surfaces and Interfaces