Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong; B. K. Ju; D. J. Lee; Y. H. Lee; N. Y. Lee; Y. W. Ko; Y. G. Moon; D. J. Choi; M. H. Oh

Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, B. K. Ju, D. J. Lee, Y. H. Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

Department of Physics

Research output: Contribution to conference › Paper › peer-review

1 Citation (Scopus)

Abstract

Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10^-7 torr vacuum level.

Original language	English
Pages	42-45
Number of pages	4
Publication status	Published - 1998
Event	Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA Duration: 1998 Jul 19 → 1998 Jul 24

Other

Other	Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC
City	Asheville, NC, USA
Period	98/7/19 → 98/7/24

ASJC Scopus subject areas

Surfaces and Interfaces

Cite this

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title = "Tubeless packaging of field emission display using glass to glass electrostatic bonding technology",

abstract = "Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.",

author = "Jeong, {J. W.} and Ju, {B. K.} and Lee, {D. J.} and Lee, {Y. H.} and Lee, {N. Y.} and Ko, {Y. W.} and Moon, {Y. G.} and Choi, {D. J.} and Oh, {M. H.}",

year = "1998",

language = "English",

pages = "42--45",

note = "Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC ; Conference date: 19-07-1998 Through 24-07-1998",

}

TY - CONF

T1 - Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

AU - Jeong, J. W.

AU - Ju, B. K.

AU - Lee, D. J.

AU - Lee, Y. H.

AU - Lee, N. Y.

AU - Ko, Y. W.

AU - Moon, Y. G.

AU - Choi, D. J.

AU - Oh, M. H.

PY - 1998

Y1 - 1998

N2 - Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.

AB - Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.

UR - http://www.scopus.com/inward/record.url?scp=0032315152&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032315152&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0032315152

SP - 42

EP - 45

T2 - Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC

Y2 - 19 July 1998 through 24 July 1998

ER -

Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

Abstract

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ASJC Scopus subject areas

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