Abstract
This paper describes a twin-plate electrowetting configuration for efficient digital microfluidics. In the twin-plate configuration, the electrowetting force doubles compared to a standard two plate configuration because the chord length of the effective three-phase contact line increases 2-fold with the grounded liquid droplet. For the realization of a twin-plate electrowetting device, two identical ground-type single-plate devices were attached with a gap after aligning their control electrode arrays facing each other. As a result, the twin-plate electrowetting device showed significantly faster droplet velocity than that of the two-plate device, and the required voltage to obtain the same velocity reduced down to between 70% and 80% compared to that of the two-plate device.
| Original language | English |
|---|---|
| Pages (from-to) | 1581-1585 |
| Number of pages | 5 |
| Journal | Sensors and Actuators, B: Chemical |
| Volume | 160 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2011 Dec 15 |
Keywords
- Digital microfluidics
- Electrowetting configurations
- Electrowetting force
- Low-voltage electrowetting
- Twin-plate electrowetting
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering
- Materials Chemistry