Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications

C. Yi, H. Lee, K. J. Lee, J. H. Joo, J. B. Kwon, M. Kim

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


A new and effective millimeter-wave waveguide packaging technique suitable for 1-D spatial power-combining applications is presented. The transition structure using narrow corporate channels preserves the uniform field distribution when expanding the ${E}$ -plane width of a standard waveguide to several wavelengths. A Q-band test module, containing back-to-back transitions for an increased width from 2.84 to 52 mm, shows an average insertion loss of 0.34 dB in the 40-50-GHz range. The radiation patterns from an open-end module, cut in half from the original test module, confirm uniform field distribution across the over-mode guide aperture.

Original languageEnglish
Article number8125586
Pages (from-to)10-12
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Issue number1
Publication statusPublished - 2018 Jan


  • Millimeter-wave power amplifiers
  • over-mode waveguide
  • spatial power combining

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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