Abstract
A new and effective millimeter-wave waveguide packaging technique suitable for 1-D spatial power-combining applications is presented. The transition structure using narrow corporate channels preserves the uniform field distribution when expanding the ${E}$ -plane width of a standard waveguide to several wavelengths. A Q-band test module, containing back-to-back transitions for an increased width from 2.84 to 52 mm, shows an average insertion loss of 0.34 dB in the 40-50-GHz range. The radiation patterns from an open-end module, cut in half from the original test module, confirm uniform field distribution across the over-mode guide aperture.
| Original language | English |
|---|---|
| Article number | 8125586 |
| Pages (from-to) | 10-12 |
| Number of pages | 3 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Volume | 28 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2018 Jan |
Bibliographical note
Funding Information:Manuscript received July 30, 2017; revised September 21, 2017; accepted October 26, 2017. Date of publication December 1, 2017; date of current version January 8, 2018. This research was supported in part by LIG Nex1 and in part by the Institute for Information and Communications Technology Promotion funded by Korean Government (MSIT) under Grant B0717-16-0047. (Corresponding author: M. Kim.) C. Yi, H. Lee, and M. Kim are with the School of Electrical Engineering, Korea University, Seoul 02841, South Korea (e-mail: [email protected]).
Publisher Copyright:
© 2001-2012 IEEE.
Keywords
- Millimeter-wave power amplifiers
- over-mode waveguide
- spatial power combining
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering