Unraveling the Mechanical Property Decrease of Electrospun Spider Silk: A Molecular Dynamics Simulation Study

  • Hongchul Shin
  • , Taeyoung Yoon
  • , Wooboum Park
  • , Juneseok You*
  • , Sungsoo Na*
    • *Corresponding author for this work

    Research output: Contribution to journal › Article › peer-review

    7 Citations (Scopus)

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    Keyphrases

    Engineering

    Material Science