Using Ag sinter paste to improve the luminous flux and reliability of InGaN-Based LED package for commercial vehicle daytime running light

Ho Young Kim; Jae Moon Lee; Kyoung Mo Kang; Jong Woo Lee; Young Min Moon; Jeong Tak Oh; Hwan Hee Jeong; Kwang Ho Park; Tae Yeon Seong

doi:10.1149/2162-8777/abdc44

Using Ag sinter paste to improve the luminous flux and reliability of InGaN-Based LED package for commercial vehicle daytime running light

Ho Young Kim, Jae Moon Lee, Kyoung Mo Kang, Jong Woo Lee, Young Min Moon, Jeong Tak Oh, Hwan Hee Jeong, Kwang Ho Park, Tae Yeon Seong

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

We investigated the effect of different types of die attach adhesives on the performance and reliability of InGaN-based LED packages. At 260 °C, the average shear strength was 10.00 and 22.30 MPa for Ag epoxy and Ag sinter paste samples, respectively. LED packages with the Ag sinter paste produced lower thermal resistance than the Ag epoxy paste sample. The Ag epoxy and sinter paste samples gave the thermal resistance (from junction to PCB) of 9.82 and 9.27 K W-1, respectively. The chip temperature of the Ag epoxy and sinter paste samples was 122.1 °C and 121.5 °C, respectively. The Ag sinter paste contained smaller Ag flake and less resin than the Ag epoxy paste sample. The luminance flux at 700 mA of LED packages with the Ag sinter and epoxy pastes was 177.5 lm and 176.8 lm at 85 °C. Unlike the Ag sinter paste samples, 60% of the Ag epoxy paste samples were cracked at 300 °C. The luminous flux maintenance of the Ag epoxy and sinter paste samples was 97.36% and 99.54%, respectively. Unlike the Ag epoxy paste samples, the Ag sinter paste samples exhibited higher stability against delamination (cracking) and higher lumen maintenance than the Ag epoxy paste samples.

Original language	English
Article number	015004
Journal	ECS Journal of Solid State Science and Technology
Volume	10
Issue number	1
DOIs	https://doi.org/10.1149/2162-8777/abdc44
Publication status	Published - 2021 Jan

Bibliographical note

Funding Information:
This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160) and the Institute of Civil Military Technology Cooperation funded by the Defense Acquisition Program Administration.

Publisher Copyright:
© 2021 The Electrochemical Society ("ECS").

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

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10.1149/2162-8777/abdc44

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Kim, H. Y., Lee, J. M., Kang, K. M., Lee, J. W., Moon, Y. M., Oh, J. T., Jeong, H. H., Park, K. H., & Seong, T. Y. (2021). Using Ag sinter paste to improve the luminous flux and reliability of InGaN-Based LED package for commercial vehicle daytime running light. ECS Journal of Solid State Science and Technology, 10(1), Article 015004. https://doi.org/10.1149/2162-8777/abdc44

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title = "Using Ag sinter paste to improve the luminous flux and reliability of InGaN-Based LED package for commercial vehicle daytime running light",

abstract = "We investigated the effect of different types of die attach adhesives on the performance and reliability of InGaN-based LED packages. At 260 °C, the average shear strength was 10.00 and 22.30 MPa for Ag epoxy and Ag sinter paste samples, respectively. LED packages with the Ag sinter paste produced lower thermal resistance than the Ag epoxy paste sample. The Ag epoxy and sinter paste samples gave the thermal resistance (from junction to PCB) of 9.82 and 9.27 K W-1, respectively. The chip temperature of the Ag epoxy and sinter paste samples was 122.1 °C and 121.5 °C, respectively. The Ag sinter paste contained smaller Ag flake and less resin than the Ag epoxy paste sample. The luminance flux at 700 mA of LED packages with the Ag sinter and epoxy pastes was 177.5 lm and 176.8 lm at 85 °C. Unlike the Ag sinter paste samples, 60% of the Ag epoxy paste samples were cracked at 300 °C. The luminous flux maintenance of the Ag epoxy and sinter paste samples was 97.36% and 99.54%, respectively. Unlike the Ag epoxy paste samples, the Ag sinter paste samples exhibited higher stability against delamination (cracking) and higher lumen maintenance than the Ag epoxy paste samples.",

author = "Kim, {Ho Young} and Lee, {Jae Moon} and Kang, {Kyoung Mo} and Lee, {Jong Woo} and Moon, {Young Min} and Oh, {Jeong Tak} and Jeong, {Hwan Hee} and Park, {Kwang Ho} and Seong, {Tae Yeon}",

note = "Funding Information: This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160) and the Institute of Civil Military Technology Cooperation funded by the Defense Acquisition Program Administration. Publisher Copyright: {\textcopyright} 2021 The Electrochemical Society ({"}ECS{"}).",

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AU - Kim, Ho Young

AU - Lee, Jae Moon

AU - Kang, Kyoung Mo

AU - Lee, Jong Woo

AU - Moon, Young Min

AU - Oh, Jeong Tak

AU - Jeong, Hwan Hee

AU - Park, Kwang Ho

AU - Seong, Tae Yeon

N1 - Funding Information: This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160) and the Institute of Civil Military Technology Cooperation funded by the Defense Acquisition Program Administration. Publisher Copyright: © 2021 The Electrochemical Society ("ECS").

PY - 2021/1

Y1 - 2021/1

N2 - We investigated the effect of different types of die attach adhesives on the performance and reliability of InGaN-based LED packages. At 260 °C, the average shear strength was 10.00 and 22.30 MPa for Ag epoxy and Ag sinter paste samples, respectively. LED packages with the Ag sinter paste produced lower thermal resistance than the Ag epoxy paste sample. The Ag epoxy and sinter paste samples gave the thermal resistance (from junction to PCB) of 9.82 and 9.27 K W-1, respectively. The chip temperature of the Ag epoxy and sinter paste samples was 122.1 °C and 121.5 °C, respectively. The Ag sinter paste contained smaller Ag flake and less resin than the Ag epoxy paste sample. The luminance flux at 700 mA of LED packages with the Ag sinter and epoxy pastes was 177.5 lm and 176.8 lm at 85 °C. Unlike the Ag sinter paste samples, 60% of the Ag epoxy paste samples were cracked at 300 °C. The luminous flux maintenance of the Ag epoxy and sinter paste samples was 97.36% and 99.54%, respectively. Unlike the Ag epoxy paste samples, the Ag sinter paste samples exhibited higher stability against delamination (cracking) and higher lumen maintenance than the Ag epoxy paste samples.

AB - We investigated the effect of different types of die attach adhesives on the performance and reliability of InGaN-based LED packages. At 260 °C, the average shear strength was 10.00 and 22.30 MPa for Ag epoxy and Ag sinter paste samples, respectively. LED packages with the Ag sinter paste produced lower thermal resistance than the Ag epoxy paste sample. The Ag epoxy and sinter paste samples gave the thermal resistance (from junction to PCB) of 9.82 and 9.27 K W-1, respectively. The chip temperature of the Ag epoxy and sinter paste samples was 122.1 °C and 121.5 °C, respectively. The Ag sinter paste contained smaller Ag flake and less resin than the Ag epoxy paste sample. The luminance flux at 700 mA of LED packages with the Ag sinter and epoxy pastes was 177.5 lm and 176.8 lm at 85 °C. Unlike the Ag sinter paste samples, 60% of the Ag epoxy paste samples were cracked at 300 °C. The luminous flux maintenance of the Ag epoxy and sinter paste samples was 97.36% and 99.54%, respectively. Unlike the Ag epoxy paste samples, the Ag sinter paste samples exhibited higher stability against delamination (cracking) and higher lumen maintenance than the Ag epoxy paste samples.

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Using Ag sinter paste to improve the luminous flux and reliability of InGaN-Based LED package for commercial vehicle daytime running light

Abstract

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