Vacuum packaging using anodic bonding and emission characteristics of FED

Duck Jung Lee; Byeong Kwon Ju; Jee Won Jeong; Hoon Kim; Sung Jae Jung; Jin Jang; Myung Hwan Oh

doi:10.1109/ASID.1999.762712

Vacuum packaging using anodic bonding and emission characteristics of FED

Duck Jung Lee, Byeong Kwon Ju, Jee Won Jeong, Hoon Kim, Sung Jae Jung, Jin Jang, Myung Hwan Oh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.

Original language	English
Title of host publication	Proceedings of the 5th Asian Symposium on Information Display, ASID 1999
Editors	Han-Ping D. Shieh, I-Wei Wu
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	53-56
Number of pages	4
ISBN (Electronic)	9579734798, 9789579734790
DOIs	https://doi.org/10.1109/ASID.1999.762712
Publication status	Published - 1999
Externally published	Yes
Event	5th Asian Symposium on Information Display, ASID 1999 - Hsinchu, Taiwan, Province of China Duration: 1999 Mar 17 → 1999 Mar 19

Publication series

Name	Proceedings of the 5th Asian Symposium on Information Display, ASID 1999

Other

Other	5th Asian Symposium on Information Display, ASID 1999
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	99/3/17 → 99/3/19

Bibliographical note

Funding Information:
This research was supported by the Ministry of Science and Technology and the Ministry of Industry and Energy under Micromachinine Technology Development Program. Also, It was partially supported by the contract of KIST to KETVETRI under Grant No. KIST-2M07550.

Publisher Copyright:
© 1999 SID Taipei Chapter.

Keywords

Glass bonding
Leak test
Light emission
Packaged FED
Silicon film
Stability

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Media Technology

Access to Document

10.1109/ASID.1999.762712

Cite this

Lee, D. J., Ju, B. K., Jeong, J. W., Kim, H., Jung, S. J., Jang, J., & Oh, M. H. (1999). Vacuum packaging using anodic bonding and emission characteristics of FED. In H.-P. D. Shieh, & I.-W. Wu (Eds.), Proceedings of the 5th Asian Symposium on Information Display, ASID 1999 (pp. 53-56). Article 762712 (Proceedings of the 5th Asian Symposium on Information Display, ASID 1999). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASID.1999.762712

Vacuum packaging using anodic bonding and emission characteristics of FED. / Lee, Duck Jung; Ju, Byeong Kwon; Jeong, Jee Won et al.
Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. ed. / Han-Ping D. Shieh; I-Wei Wu. Institute of Electrical and Electronics Engineers Inc., 1999. p. 53-56 762712 (Proceedings of the 5th Asian Symposium on Information Display, ASID 1999).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, DJ, Ju, BK, Jeong, JW, Kim, H, Jung, SJ, Jang, J & Oh, MH 1999, Vacuum packaging using anodic bonding and emission characteristics of FED. in H-PD Shieh & I-W Wu (eds), Proceedings of the 5th Asian Symposium on Information Display, ASID 1999., 762712, Proceedings of the 5th Asian Symposium on Information Display, ASID 1999, Institute of Electrical and Electronics Engineers Inc., pp. 53-56, 5th Asian Symposium on Information Display, ASID 1999, Hsinchu, Taiwan, Province of China, 99/3/17. https://doi.org/10.1109/ASID.1999.762712

Lee DJ, Ju BK, Jeong JW, Kim H, Jung SJ, Jang J et al. Vacuum packaging using anodic bonding and emission characteristics of FED. In Shieh HPD, Wu IW, editors, Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. Institute of Electrical and Electronics Engineers Inc. 1999. p. 53-56. 762712. (Proceedings of the 5th Asian Symposium on Information Display, ASID 1999). doi: 10.1109/ASID.1999.762712

Lee, Duck Jung ; Ju, Byeong Kwon ; Jeong, Jee Won et al. / Vacuum packaging using anodic bonding and emission characteristics of FED. Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. editor / Han-Ping D. Shieh ; I-Wei Wu. Institute of Electrical and Electronics Engineers Inc., 1999. pp. 53-56 (Proceedings of the 5th Asian Symposium on Information Display, ASID 1999).

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abstract = "In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.",

keywords = "Glass bonding, Leak test, Light emission, Packaged FED, Silicon film, Stability",

author = "Lee, {Duck Jung} and Ju, {Byeong Kwon} and Jeong, {Jee Won} and Hoon Kim and Jung, {Sung Jae} and Jin Jang and Oh, {Myung Hwan}",

note = "Funding Information: This research was supported by the Ministry of Science and Technology and the Ministry of Industry and Energy under Micromachinine Technology Development Program. Also, It was partially supported by the contract of KIST to KETVETRI under Grant No. KIST-2M07550. Publisher Copyright: {\textcopyright} 1999 SID Taipei Chapter.; 5th Asian Symposium on Information Display, ASID 1999 ; Conference date: 17-03-1999 Through 19-03-1999",

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AU - Jang, Jin

AU - Oh, Myung Hwan

N1 - Funding Information: This research was supported by the Ministry of Science and Technology and the Ministry of Industry and Energy under Micromachinine Technology Development Program. Also, It was partially supported by the contract of KIST to KETVETRI under Grant No. KIST-2M07550. Publisher Copyright: © 1999 SID Taipei Chapter.

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N2 - In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.

AB - In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.

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BT - Proceedings of the 5th Asian Symposium on Information Display, ASID 1999

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ER -

Vacuum packaging using anodic bonding and emission characteristics of FED

Abstract

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Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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